Luftgefüllte Wellenleiteranordnung mit Überbrückungsschicht

Details

Veröffentlichungs-Nr.

EP4819378

Anmeldetag

31. März 2025

Veröffentlichung

7. Oktober 2026

Rechtsraum

EP

Abstract

According to the present disclosure, there is provided an air-filled waveguide, AWG, assembly for use with a launcher-in-package semiconductor device, and comprising a stack of; a first laminate structure configured to be coupled to a semiconductor die, and having a first aperture therethrough; a second laminate structure affixed to the first laminate structure, having a second aperture, aligned with the first aperture, therethrough, and having a main AWG there-along; and a third laminate structure affixed to the second laminate structure, and having at least one bridging AWG there-along; wherein the AWG assembly is arranged to guide a microwave or millimetre-wave signal between the semiconductor die and the AWG in the second laminate, through the first and second aperture and along the bridging AWG.

Anmelder

Firma

NXP USA, Inc.

Land

🇺🇸 USA