Vertikaler Balun für Differenz-Zu-Eintakt-Übergang von Mm-Wellensignalen
Anmelder: NXP B.V. 🇳🇱
Details
- Veröffentlichungs-Nr.
- EP4819379
- Anmeldetag
- 24. März 2026
- Veröffentlichung
- 7. Oktober 2026
- Rechtsraum
- EP
- IPC
- H01P5/10
Abstract
A multi-level panel level package substrate is formed with a compact vertical balun for converting between single-ended and differential-ended signals, where the vertical balun includes a first non-phase-shifting conductive balun path element having one or more vertically aligned conductive structures formed in at least two package layers and connected between a first differential-ended signal balun node and a single-ended signal balun node; a second phase-shifting conductive balun path element having a plurality of conductive structures formed in at least two package layers and connected between a second differential-ended signal balun node and the single-ended signal balun node; and a single-ended contact element integrally formed with the single-ended signal balun node at a package layer location where the first non-phase-shifting conductive balun path element is directly, electrically connected to the second phase-shifting conductive balun path element.
Anmelder
- Firma
- NXP B.V.
- Land
- 🇳🇱 Niederlande
Niederländischer Halbleiterhersteller mit Sitz in Eindhoven. Entwickelt Chips und Halbleiterlösungen für Automobiltechnik, Kommunikation, Sicherheit sowie industrielle Anwendungen.
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