Komponententräger mit mindestens einer Öffnung und Verfahren zur Herstellung eines Komponententrägers

Details

Veröffentlichungs-Nr.

EP4819769

Anmeldetag

24. März 2026

Veröffentlichung

7. Oktober 2026

Rechtsraum

EP

IPC

H05K1/11, // H05K1/02

Abstract

There is described a component carrier (100) and a method of manufacturing a component carrier. The component carrier comprises: at least one electrically insulating layer structure (106) and at least one electrically conductive layer structure (104); wherein said at least one insulating layer structure (106) comprises at least one opening (108) which connects a main surface (101) of the at least one electrically insulating layer structure (106) with at least part of the at least one electrically conductive layer structure (104), said at least one opening (108) being delimited by a lateral wall (109), said lateral wall (109) comprising two portions, a first portion (109a) and a second portion (109b), one above the other in a thickness direction of the at least one insulating layer structure (106), wherein said two portions (109a, 109b) have a different extension one to each other in the thickness direction of the at least one insulating layer structure (106).

Anmelder

Firma

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Land

🇦🇹 Österreich

Fachgebiete