Komponententräger mit Eingebetteten Öffnungen

Details

Veröffentlichungs-Nr.

EP4819773

Anmeldetag

31. März 2025

Veröffentlichung

7. Oktober 2026

Rechtsraum

EP

Abstract

The present invention describes a component carrier (100) comprising a stack with a plurality of electrically insulating layer structures, wherein a first one (101) of the plurality of electrically insulating layer structures comprising a through hole (104) passing from a first main surface (105) to an opposed second main surface (106) of the first electrically insulating layer structure (101). A second one (102) of the plurality of electrically insulating layer structures comprises fillers (111) embedded therein, wherein the second electrically insulating layer structure (102) comprises a third main surface (107) in contact with the first main surface (105) of the first electrically insulating layer structure (101), closing the through hole (104), and comprises a fourth main surface (108) opposed to the third main surface (107). The second electrically insulating layer structure (102) comprises a cover portion (109) and a surrounding portion (110), wherein the cover portion (109) overlaps the through hole (104). The fillers (111) in the surrounding portion (110) are closer to the fourth main surface (108) than the fillers (111) in the cover portion (109).

Anmelder

Firma

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Land

🇦🇹 Österreich