Elektronische Vorrichtung mit Isolierungsplattenabdeckung

Details

Veröffentlichungs-Nr.

EP4819823

Anmeldetag

24. März 2026

Veröffentlichung

7. Oktober 2026

Rechtsraum

EP

Abstract

The present invention relates to an electronic device comprising a novel insulation plate cover and a grounding piece. The electronic device including the insulation plate cover comprises a plate-shaped insulation plate in contact with a semiconductor element, a heat sink protruding in a planar manner and including a protrusion in contact with the insulation plate, and an insulation plate cover coupling the insulation plate and the heat sink. The insulation plate cover may include a hollow frame, a first wall formed inside the frame to surround sides of the protrusion of the heat sink, and a second wall formed outside the frame to surround sides of the insulation plate. The electronic device including the grounding piece comprises a case, a mounting body formed of a conductive metal and protruding in a planar manner from the case, and a grounding piece assembled on the mounting body with a bolt. The mounting body may include a mounting groove concavely recessed on a top surface and a tab hole for receiving the bolt.

Anmelder

Firma

LG Innotek Co., Ltd.

Land

🇰🇷 Südkorea