Halbleitergehäuse mit Stromversorgungskondensator

Details

Veröffentlichungs-Nr.

EP4819825

Anmeldetag

9. Februar 2026

Veröffentlichung

7. Oktober 2026

Rechtsraum

EP

Abstract

A semiconductor package including a first semiconductor chip, a plurality of second semiconductor chips stacked on the first semiconductor chip in a first direction perpendicular to an upper surface of the first semiconductor chip, an upper semiconductor chip stacked on the uppermost second semiconductor chip among the plurality of second semiconductor chips, and a dummy semiconductor chip stacked on the upper semiconductor chip and including a capacitor. The upper semiconductor chip includes an upper through via that passes through at least a portion of the upper semiconductor chip and is electrically connected to the capacitor.

Anmelder

Firma

Samsung Electronics Co., Ltd.

Land

🇰🇷 Südkorea