Struktur und Verfahren zur Befestigung von Halbleiterchips

Details

Veröffentlichungs-Nr.

EP4823309

Anmeldetag

10. März 2026

Veröffentlichung

14. Oktober 2026

Rechtsraum

EP

Abstract

The present disclosure relates to a package assembly including an integrated circuit die having standoff structures and associated methods of die attach and fabrication. The package may include an integrated circuit die having standoff structures disposed on a bottom surface of the integrated circuit die, a die pad structure on which the integrated circuit die is disposed, and die attach material disposed between the integrated circuit die and the die pad structure. The standoff structures can include metallic ink. The standoff structures may contact an upper surface of the die pad structure. The die attach material may attach the integrated circuit die to the die pad structure.

Anmelder

Firma

NXP USA, Inc.

Land

🇺🇸 USA