Entwürfe zur Verkapselung von Sensorkomponenten mit Öffnungen zum Betrieb und Verfahren zur Herstellung davon

Details

Veröffentlichungs-Nr.

EP4826439

Anmeldetag

14. April 2026

Veröffentlichung

21. Oktober 2026

Rechtsraum

EP

IPC

G02C11/00, H04R1/08

Abstract

A wearable device including one or more sensors and one or more through-holes extending from an exterior portion of the first material to an interior portion of the first material where the one or more sensors are embedded is described. The wearable device includes a first material. The wearable device further includes a shield material, the shield material having a heat tolerance greater than a heat tolerance of the first material. The wearable device further includes one or more sensors positioned beneath the shield material and embedded within an overmolded portion of the first material. The wearable device further includes a through-hole, extending from an exterior portion of the first material to an interior portion of the first material where the one or more sensors are embedded, wherein the one or more sensors detect data via the through-hole.

Anmelder

Firma

Meta Platforms Technologies, LLC

Land

🇺🇸 USA

Fachgebiete