Leistungsmodul, Leistungsumwandlungsvorrichtung und Leiterrahmen

Details

Veröffentlichungs-Nr.

EP4827311

Anmeldetag

31. März 2026

Veröffentlichung

21. Oktober 2026

Rechtsraum

EP

Abstract

This application relates to the field of power electronics technologies, and in particular, to a power module, a power conversion device, and a lead frame. The power module includes a substrate, an electronic element, and at least one mechanical part, the substrate includes a ceramic baseplate, and a first metal layer and a second metal layer that are disposed on two surfaces of the ceramic baseplate, both the electronic element and each mechanical part are disposed on a surface that is of the first metal layer and that is away from the ceramic baseplate, and brittleness of the mechanical part is less than brittleness of the ceramic baseplate. In a direction perpendicular to the substrate, an orthographic projection of any mechanical part on the first metal layer does not overlap with an orthographic projection of the electronic element on the first metal layer. Each mechanical part is used for being pressed against by an ejector pin of a mold in an injection molding packaging process. In an injection molding process, the power module can reduce a possibility of an undetectable micro crack generated in the ceramic baseplate under force, thereby improving product reliability, and helping improve production yield of the power module.

Anmelder

Firma

HUAWEI TECHNOLOGIES CO., LTD.

Land

🇨🇳 China