Leiterrahmen, Lufthohlraumpackungen und elektronische Vorrichtungen mit versetzten Abzugsöffnungen, und Verfahren zur Herstellung davon

Details

Veröffentlichungs-Nr.

EP2704192

Aktenzeichen

EP13179590

Anmeldetag

7. August 2013

Veröffentlichung

10. Juli 2019

Erteilung

10. Juli 2019

Rechtsraum

EP

IPC

H01L23/495H01L23/498H01L23/10H01L23/04

Abstract

A leadframe (300, 700) (e.g., incorporated in a device package) includes a feature (310, 322, 710, 722) (e.g., a die pad or lead) with a vent hole (336, 736) formed between first and second opposed surfaces (410, 412). The cross-sectional area of the vent hole varies substantially between the surfaces (e.g., the vent hole has a constricted portion (460)). The vent hole may be formed from a first opening (420) extending from the first surface toward the second surface to a first depth (452) that is less than a thickness (450) of the leadframe feature, and a second opening (430) extending from the second surface toward the first surface to a second depth (454) that is less than the thickness of the leadframe feature, but that is large enough for the second opening to intersect the first opening. Vertical central axes (428, 429) of the openings are horizontally offset from each other, and the constricted portion of the vent hole corresponds to the intersection of the openings.

Anmelder

Firmen

NXP USA, Inc.
Freescale Semiconductor, Inc.

Land

🇺🇸 USA

Fachgebiete