Kupplungsanordnung für Leistungshalbleitervorrichtung und Leiterplatte sowie Verfahren zur Herstellung davon

Details

Veröffentlichungs-Nr.

EP2706828

Aktenzeichen

EP13182978

Anmeldetag

4. September 2013

Veröffentlichung

6. März 2019

Erteilung

6. März 2019

Rechtsraum

EP

IPC

H05K3/30H05K7/20H01L23/00H01L23/40// H05K1/02H05K3/34

Abstract

Provided is a coupling assembly of a power semiconductor device and a printed circuit board (PCB). The coupling assembly of the power semiconductor device and the printed circuit board (PCB) includes a PCB 300, a power semiconductor device 100 comprising a plurality of legs 110 electrically connected to a circuit pattern disposed on the PCB, a connection member 200 disposed above the power semiconductor device, the connection member being formed of an electrically conductive material, a main fixing unit 410 fixing the power semiconductor device to the PCB, and a housing disposed outside the PCB. Thus, a coupling force between the power semiconductor device and the PCB and electric efficiency may be improved to a heat generation amount. In addition, heat may be more quickly dissipated through the connection member to improve a cooling effect.

Anmelder

Firma

LSIS Co., Ltd.

Land

🇰🇷 Südkorea

Fachgebiete