Magnetische Konfiguration für ein Magnetron-Sputterauftragungssystem

Details

Veröffentlichungs-Nr.

EP2811507

Aktenzeichen

EP13171155

Anmeldetag

7. Juni 2013

Veröffentlichung

19. Februar 2020

Erteilung

19. Februar 2020

Rechtsraum

EP

IPC

H01J37/32H01J37/34

Abstract

A sputter deposition magnetron system for sputtering material, the sputter deposition magnetron system comprising at least a first and a second sputter magnetron unit. Each of the magnetron units (102, 106) comprise a magnet configuration and a mounting element for mounting a target (101, 105) so that the first and second magnet configuration contribute to the formation and confinement of a plasma allowing sputtering of the first respectively second target (101, 105). The sputter deposition magnetron system furthermore comprises at least one extra magnet configuration (103) distanced from the mounting element for targets, whereby the first, the second and the at least one magnet configuration are arranged for each contributing to a confined plasma configuration wherein at least part of the plasma is shared across the first and the second sputter magnetron unit.

Anmelder

Firma

Soleras Advanced Coatings bvba

Land

🇧🇪 Belgien

Fachgebiete