Heatsink Very-Thin Quad Flat No-Leads (hvqfn)-Packung

Details

Veröffentlichungs-Nr.

EP3121849

Aktenzeichen

EP16180307

Anmeldetag

20. Juli 2016

Veröffentlichung

23. Oktober 2019

Erteilung

23. Oktober 2019

Rechtsraum

EP

IPC

H01L23/433H01L23/495H01L21/48

Abstract

Consistent with an example embodiment, there is a method for preparing an integrated circuit (IC) device having enhanced heat dissipation. The method comprises providing a lead frame array, of a first thickness, with a plurality of die placement areas each die placement area with bond pad landings, the bond bad landings situated about a die placement area on one or multiple sides, the bond pad landings having upper surfaces and opposite lower surfaces, placing a heat sink assembly of a second thickness, having at least two mounting tabs of the first thickness, in each die placement area and attaching the at least two mounting tabs onto corresponding bond pad landings serving as anchor pads, die bonding a device die on the heat sink device assembly, conductively bonding device die bond pads to corresponding bond pad landings, and encapsulating the wire bonded device die, heat sink assembly and lead frame array in a molding compound.

Anmelder

Firma

NXP B.V.

Land

🇳🇱 Niederlande

Fachgebiete