Verpacktes Halbleiterbauelement mit einem Leiterrahmen und Innen- und Aussenanschlüssen und Verfahren zur Herstellung

Details

Veröffentlichungs-Nr.

EP3264457

Aktenzeichen

EP17170726

Anmeldetag

11. Mai 2017

Veröffentlichung

13. Dezember 2023

Erteilung

13. Dezember 2023

Rechtsraum

EP

IPC

H01L23/495H01L23/31

Abstract

A method of making a packaged integrated circuit device includes forming a lead frame with leads that have an inner portion and an outer portion, the inner portion of the lead is between a periphery of a die pad and extends to one end of openings around the die pad. The outer portion of the leads are separated along their length almost up to an opposite end of the openings. Leads in a first subset of the leads alternate with leads in a second subset of the leads. The inner portion of the first subset of the leads is bent. The die pad, the inner portion of the leads, and only a first portion of the openings adjacent the inner portion of the leads are encapsulated. A second portion of the openings and the output portions of the leads form a dam bar for the encapsulating material.

Anmelder

Firma

NXP USA, Inc.

Land

🇺🇸 USA

Fachgebiete