Substratpoliervorrichtung und Polierverfahren

Details

Veröffentlichungs-Nr.

EP3479958

Aktenzeichen

EP18204957

Anmeldetag

7. November 2018

Veröffentlichung

4. Januar 2023

Erteilung

4. Januar 2023

Rechtsraum

EP

IPC

B24B37/10B24B37/04B24B37/005B24B27/00B24B41/06B24B41/047B24B37/30B24B37/12

Abstract

One object of the present invention is to improve the uniformity of polishing in a substrate polishing device for polishing a quadrilateral-shaped substrate. The present application discloses, as one embodiment of the present invention, a substrate polishing device (100) for polishing a quadrilateral-shaped substrate (130), the substrate polishing device (100) including: a surface plate (110); a substrate support mechanism that is attached to the surface plate (110) and that supports the substrate (130); a polishing head mechanism (140) for attaching a polishing pad (150), the polishing head mechanism (140) opposing the surface plate (110); and an orbital drive mechanism (160) for orbitally driving the polishing head mechanism (140). The substrate support mechanism includes: a base plate (121); a plate flow passage (520A, 520C, 520E) provided to the base plate (121); and a plurality of substrate support chambers (510A, 510C, 510E) that are connected to the plate flow passage (520A, 520C, 520E), wherein each substrate support chamber (510A, 510C, 510E) independently applies a vertical direction force to the substrate (130), and the vertical direction force applied to the substrate (130) corresponds to an internal pressure of the substrate support chamber (510A, 510C, 510E).

Anmelder

Firmen

EBARA CORPORATION
Ebara Corporation

Land

🇯🇵 Japan

Fachgebiete