Vorrichtung und Verfahren zur Behandlung einer Oberfläche eines Substrats

Details

Veröffentlichungs-Nr.

EP3483924

Aktenzeichen

EP18205424

Anmeldetag

9. November 2018

Veröffentlichung

5. Januar 2022

Erteilung

5. Januar 2022

Rechtsraum

EP

IPC

H01L21/67B24B37/10B24B55/12B08B1/00B24B9/06B24B21/00B24B37/30B24B37/04H01L21/304B24B21/06// H01L21/687B24B41/06B24B1/00

Abstract

An apparatus and a method which can perform different processes, such as polishing and cleaning, on a surface of a substrate, such as a wafer, with a single processing head, and can process the surface of the substrate efficiently are disclosed. The apparatus according to the present invention includes: a substrate holder configured to hold a substrate and rotate the substrate; and a processing head configured to bring scrubbing tapes into contact with a first surface of the substrate to process the first surface. The processing head includes: pressing members arranged to press the scrubbing tapes against the first surface of the substrate; position switching devices configured to be able to switch positions of the pressing members between processing positions and retreat positions; tape feeding reels configured to feed the scrubbing tapes, respectively; and tape take-up reels configured to take up the scrubbing tapes, respectively.

Anmelder

Firma

Ebara Corporation

Land

🇯🇵 Japan

Fachgebiete