Gehäusekühlung

Details

Veröffentlichungs-Nr.

EP3496522

Aktenzeichen

EP18203961

Anmeldetag

1. November 2018

Veröffentlichung

4. Januar 2023

Erteilung

4. Januar 2023

Rechtsraum

EP

IPC

H05K7/20

Abstract

Example implementations relate to a chassis cooling device. In some examples, a chassis cooling device may include a manifold (102-1..102-N) within the chassis to distribute a cooling resource among a cooling loop (104-1...104-N) and a heat exchanger (106); a first plurality of pumps (108-1,108-2), coupled to a cooling loop return portion of the manifold, arranged in parallel in the chassis to pump the cooling resource; and a second plurality of pumps (108-3,108-4), coupled to a cooling loop supply portion of the manifold, arranged in parallel in the chassis to pump the cooling resource, wherein the second plurality of pumps are arranged in series with the first plurality of pumps.

Anmelder

Firma

Hewlett Packard Enterprise Development LP

Land

🇺🇸 USA

Fachgebiete