Optisches Halbleiterelement

Details

Veröffentlichungs-Nr.

EP3595022

Aktenzeichen

EP19186106

Anmeldetag

12. Juli 2019

Veröffentlichung

22. Dezember 2021

Erteilung

22. Dezember 2021

Rechtsraum

EP

IPC

H01L33/38H01L33/62H01L33/64// H01L33/00H01L23/00

Abstract

Provided is an optical semiconductor element (11) in which an unbonded portion between an optical semiconductor chip (20) and a submount (12) is made small, the heat dissipation efficiency becomes high, and the service life can be made long.The optical semiconductor element (11) can include: a plate-shaped submount (12) having a mounting surface; a submount electrode (13) provided on the mounting surface of the submount (12) and having a rectangular shape as a whole; and a semiconductor chip (20) including an element substrate (18), a semiconductor structure layer (19) formed on the element substrate (18), and a chip electrode (17) bonded to the submount electrode (13) via a bonding layer (15). Herein, the chip electrode (17) has a shape with chipped corners corresponding to four corners of the submount electrode (13), the submount electrode (13) has an exposed surface that is a portion exposed from the chip electrode (17) at the four corners and bonded to the chip electrode (17) to coincide with each other, and the bonding layer (15) extends to all the four corners of the exposed surface (13S).

Anmelder

Firma

STANLEY ELECTRIC CO., LTD.

Land

🇯🇵 Japan

Fachgebiete