Leitungsloses Halbleitergehäuse mit Doppelseitiger Bolzenstruktur für Fan-Out von Chip zu Gehäuse

Details

Veröffentlichungs-Nr.

EP4443498

Aktenzeichen

EP24167596

Anmeldetag

28. März 2024

Veröffentlichung

21. Januar 2026

Erteilung

21. Januar 2026

Rechtsraum

EP

IPC

H01L23/498H01L23/31H01L21/48H01L23/538H01L23/00// H01L21/56H01L23/495H01L21/683

Abstract

A leadless semiconductor package includes an integrated circuit (IC) die having one or more contacts at an active surface facing a mounting surface of the leadless semiconductor package. The leadless semiconductor package further includes a plurality of dual-sided stud structures providing electrical connectivity between the IC die and the mounting surface, each dual-sided stud structure having at least one first conductive pillar structure extending from a corresponding contact at the active surface to a redistribution layer and having at least one second conductive pillar structure extending from a redistribution layer to an edge of the mounting surface, each first conductive pillar structure having a first dimension in a direction parallel to the mounting surface that is less than a corresponding second dimension of each second conductive pillar structure. Solder wettable flanks may be formed at the external sidewall edges of the second conductive pillar structures to facilitate soldering or inspection.

Anmelder

Firma

NXP B.V.

Land

🇳🇱 Niederlande

Fachgebiete