Wiederverwendbares Modulares Substrat
Anmelder: NXP USA, Inc. 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4510785
- Aktenzeichen
- EP24194497
- Anmeldetag
- 14. August 2024
- Veröffentlichung
- 19. Februar 2025
- Rechtsraum
- EP
- IPC
- H05K1/18H05K3/32H01L23/00// H05K1/02
Abstract
System (600) comprising a multi-layer PCB (500) and a device (100) connected to the PCB. The device comprises an electronic component (102) that is mounted on a first surface of a substrate (106), the substrate comprising a plurality of through-hole vias (108) that connect the contacts of the electronic component from the first surface of the substrate to the second surface. The connection between the PCB and the device is implemented by means of magnetic deposits (116, 506) that are provided on both the second surface of the substrate and the contacting surface of the PCB.
Anmelder
- Firma
- NXP USA, Inc.
- Land
- 🇺🇸 USA
US-amerikanische Gesellschaft des Halbleiterkonzerns NXP, die Chips und Halbleiterlösungen für Automobiltechnik, Kommunikation und Industrieelektronik entwickelt.
1.545 Patente in unserer Datenbank
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Hardingham, Christopher Mark
NXP Semiconductors · Hamburg