Doppelseitige Mehrchip-Kapselungen mit Direkter Verbindung zwischen Chips

Details

Veröffentlichungs-Nr.

EP4517804

Aktenzeichen

EP24195219

Anmeldetag

19. August 2024

Veröffentlichung

5. März 2025

Rechtsraum

EP

IPC

H01L25/065H01L21/768H01L25/10// H01L21/48H01L23/31H01L23/48H01L23/498H01L23/538

Abstract

A multi-chip package includes two electronic components bonded to each other via electrical contacts on corresponding faces of the components that are directly opposite each other. The components are encapsulated in a volume of molding material that includes a upper and lower sets of redistribution layers disposed on upper and lower surfaces of the volume of molding material that include electrical interconnects. The package includes one or more through-package interconnects that pass through the molding material. A first through-package interconnect couples an electrically conductive interconnect in a first redistribution layer to an electrically conductive interconnect in a second redistribution layer on an opposite side of the volume of molding material from the first redistribution layer, or it couples the interconnect to one of the components within the volume of molding material.

Anmelder

Firma

NXP USA, Inc.

Land

🇺🇸 USA

Fachgebiete