Antenne zur Mm-Wellen-Signalübertragung
Anmelder: NXP B.V. 🇳🇱
Details
- Veröffentlichungs-Nr.
- EP4712261
- Anmeldetag
- 8. September 2025
- Veröffentlichung
- 18. März 2026
- Rechtsraum
- EP
Abstract
An electronic device realizes an antenna-in-package (AiP). The device includes a first die having a first metal layer that defines an antenna patch, a second metal layer that defines a parasitic patch above and vertically aligned with the antenna patch, and an amplifier having an output terminal electrically coupled to the antenna patch. The device further includes a second die having a metal layer that defines a reflecting patch and an interconnect that joins the first die with the second die in a vertical stack with the first die above the second die such that the antenna patch is spaced apart from, parallel to, and vertically aligned with the reflecting patch.
Anmelder
- Firma
- NXP B.V.
- Land
- 🇳🇱 Niederlande
Niederländischer Halbleiterhersteller mit Sitz in Eindhoven. Entwickelt Chips und Halbleiterlösungen für Automobiltechnik, Kommunikation, Sicherheit sowie industrielle Anwendungen.
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Hardingham, Christopher Mark
NXP Semiconductors · Hamburg