Invertierter Koaxialer Substratverbinder
Anmelder: TE Connectivity Solutions GmbH 🇨🇭
Details
- Veröffentlichungs-Nr.
- EP4712274
- Anmeldetag
- 15. September 2025
- Veröffentlichung
- 18. März 2026
- Rechtsraum
- EP
- IPC
- H01R24/50, // H01R12/57
Abstract
An electrical assembly (2) having a substrate (52) and an RF connector (10). The substrate (52) has an opening (50) which extends from a first surface (54) of the substrate to a second surface (56) of the substrate. The RF connector (10) includes a conductive shell (12), a dielectric insert (14) and a contact (16). The conductive shell (12) has a mating connector receiving portion (18) and a substrate mounting portion (22). The substrate mounting portion (22) has a substrate mounting surface (24) which engages the first surface (54) of the substrate (52). The mating connector receiving portion (18) extends from the substrate mounting surface (24) through the opening (50) to the second surface (56) of the substrate (52). The contact (16) has a surface mount portion (37) positioned proximate the substrate mounting surface (24) of the substrate mounting portion (22). The surface mount portion (37) is mechanically and electrically engaged with a contact pad (62) on the first surface (54) of the substrate (52).
Anmelder
- Firma
- TE Connectivity Solutions GmbH
- Land
- 🇨🇭 Schweiz
Schweizer Konzerngesellschaft von TE Connectivity mit Sitz in Schaffhausen. Sie entwickelt Verbindungs- und Sensortechnik für Automobil-, Industrie- und Kommunikationsanwendungen.
418 Patente in unserer Datenbank
Entstand 2008 aus dem Zusammenschluss der britischen Kanzleien Baron & Warren (1924) und G. F. Redfern & Co. (Wurzeln bis 1830). Von Brentford aus betreut sie Konzerne wie Stellantis und Start-ups, mit kostenloser Erstberatung und schneller Reaktionszeit.