Substratverpackung

Details

Veröffentlichungs-Nr.

EP4738437

Anmeldetag

8. Januar 2025

Veröffentlichung

6. Mai 2026

Rechtsraum

EP

IPC

H01L23/498, H05K1/02, H05K3/34

Abstract

There is provided a substrate package and method of manufacturing thereof. The substrate package comprises a carrier; a substrate having a first major surface and a second major surface, wherein the second major surface faces the carrier; a non-conductive first barrier wall extending from the second major surface towards the carrier, the first barrier wall defining first and second regions of the substrate package; and a ball grid array comprising a plurality of solder balls located between the substrate and the carrier, wherein a first subset of the solder balls is located within the first region and a second subset of the solder balls is located within the second region.

Anmelder

Firma

NXP USA, Inc.

Land

🇺🇸 USA