LG Innotek Patente

A lighting device disclosed in an embodiment of the invention comprises: a support plate; a circuit board having a plurality of pads on one side and disposed on the support plate; a light source portion disposed on the support plate and having a light emitting device on one side and a plurality of bonding pads on the other side; a plurality of connection members respectively connecting the plurality of pads to the plurality of bonding pads; and a molding portion covering the plurality of connection members, wherein the molding portion covers a region between the light source portion and the circuit board, the plurality of bonding pads of the light source portion, and the pads of the circuit board, and a position of the highest point of the molding portion may be disposed on a region between the light source portion and the circuit board.

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

A lighting device disclosed in an embodiment of the invention comprises: a heat dissipation plate including a recess portion; a circuit board disposed in the recess portion and having a pad; a light source portion disposed on the heat dissipation plate and including a bonding pad and a light emitting device; a connection member connecting the pad of the circuit board and the bonding pad of the light source portion; and a sealing portion disposed on the connection member, wherein the sealing portion comprises a first sealing portion forming an outer perimeter; and a second sealing portion disposed inside the outer perimeter, wherein the first sealing portion and the second sealing portion comprise the same resin composition.

A smart IC substrate according to an embodiment includes a substrate including a first surface and a second surface opposite the first surface; a bonding layer disposed on the first surface; a buffer layer disposed on the bonding layer; a metal layer disposed on the buffer layer; and a plating layer disposed on a lower surface of the metal layer, wherein the metal layer includes an alloy including nickel (Ni), iron (Fe), and chromium (Cr), wherein the buffer layer includes a first buffer layer a second buffer layer, wherein the first buffer layer is disposed between the second buffer layer and the metal layer, wherein the second buffer layer comprises a second-first buffer layer and a second-second buffer layer, wherein the second-first buffer layer is disposed between the first buffer layer and the second-second buffer layer, and wherein a surface roughness of the second-second buffer layer is greater than a surface roughness of the second-first buffer layer.

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

A flexible circuit board module according to an embodiment includes a first flexible circuit board and a second flexible circuit board, wherein the first flexible circuit board includes: a substrate; a power pattern and a test pattern disposed on the substrate; and a protective layer disposed on the power pattern and the test pattern, wherein the power pattern includes a first wiring pattern, a first-first pad pattern, and a first-second pad pattern, the first-first pad pattern is connected to a display panel, the first-second pad pattern is connected to a circuit board, and a first width of the first wiring pattern is 1 mm to 3 mm.

The present invention may provide a motor which includes a shaft, a rotor coupled to the shaft, a stator disposed to correspond to the rotor, and a locking part disposed along the shaft in an axial direction, wherein the locking part includes a stopper which is movable in the axial direction, and when a signal is applied to the locking part, the stopper is engaged with the shaft in a concave-convex manner to restrict rotation of the shaft.

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

This camera module comprises: a lens module; a front body that couples to the lens module and includes an upper plate and a first side plate extending downward from the edge of the upper plate; a rear body that is coupled to the front body and includes a lower plate, facing the upper plate in the optical axis direction, and a second side plate extending upward from the edge of the lower plate; a substrate disposed in the space formed by the coupling of the front body and the rear body; and a coupling part disposed between the outer surface of the rear body and the inner surface of the front body.

A smart IC substrate according to an embodiment includes a substrate including a first surface and a second surface opposite the first surface, and having first and second holes passing through the first surface and the second surface and spaced apart from each other in a horizontal direction; a bonding layer disposed on the first surface; a metal layer disposed on the bonding layer; a first plating layer disposed on one surface of the metal layer; a second plating layer and a third plating layer disposed on another surface of the metal layer, wherein the second plating layer overlaps the first hole, the third plating layer overlaps the second hole, and the third plating layer has a thickness greater than that of the second plating layer.

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

A lighting device disclosed in an embodiment of the invention may comprises a substrate; a plurality of light emitting devices on the substrate; a resin layer covering the light emitting devices on the substrate; an optical film on the resin layer; and a plurality of light-blocking members disposed on an upper or lower surface of the optical film and vertically overlapping each of the light emitting devices. The light-blocking members include a first light-blocking portion having a first pattern of a first thickness, a second light-blocking portion having a second pattern of a second thickness greater than the first thickness, and a third light-blocking portion having a third pattern of a third thickness greater than the second thickness, wherein the first, second, and third light-blocking portions vertically overlap with the upper surfaces of each light emitting devices. The first pattern of the first light-blocking portion has a size larger than other regions around the second and third light-blocking portions, the second pattern of the second light-blocking portion has a size larger than other regions on both sides of the third light-blocking portion, and the third pattern of the third light-blocking portion may have a single size.

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

An EVCC device according to an embodiment of the present invention comprises: a load switch unit, to which a control pilot (CP) signal is input from an electric vehicle supply equipment (EVSE); a first detection unit, which is connected to the load switch unit and performs a first conversion of the CP signal into a first signal; a second detection unit, which is connected to the first detection unit and performs a second conversion of the first signal into a second signal; and an MCU, which detects the first and second signals.

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …