Shenzhen Shokz Patente

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The present disclosure relates to a method for detecting a wearing position of an earphone, an earphone, and an electronic device. The wearing position includes a left ear or a right ear of a user. The method includes: determining whether the earphone is in a wearing state, in response to the earphone is in the wearing state, acquiring a communication performance parameter of the earphone; and determining the wearing position of the earphone according to the communication performance parameter of the earphone.

A method for detecting a wearing position of an earphone is provided. The earphone is provided with a detection module and stores a wearing position indication. For each of at least one detection cycle, a pre-judgment result indicating the wearing position of the earphone at the detection cycle is obtain ed via the detection module. The pre-judgment result indicates whether the earphone is worn on a left ear or a right ear. Real-time updating on the wearing position indication is performed based on a comparison result between each of the at least one pre-judgment result and a current wearing position indication of the earphone, wherein the wearing position indication indicates whether the earphone is worn on a left ear or a right ear. The method of the present disclosure is beneficial for reducing a risk of false detection and improving accuracy of wearing position detection.

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The present disclosure relates to a headphone, and specifically relates to the technical field of electronic devices. The headphone includes a first speaker and a second speaker. A frequency band of a sound output by the first speaker is at least partially lower than a frequency band of a sound output by the second speaker. The first speaker includes a first diaphragm and a first magnetic circuit system configured to drive the first diaphragm to produce the sound. The second speaker includes a second diaphragm and a second magnetic circuit system configured to drive the second diaphragm to produce the sound. A projection of the first magnetic circuit system in a vibration direction of the first diaphragm at least partially overlaps the second magnetic circuit system. The second magnetic circuit system and the first magnetic circuit system are arranged to repel each other.

The present disclosure relates to an earphone. The earphone comprises a housing assembly including a first housing, a deformation member, and a sensor. The first housing includes a first side wall portion and a second side wall portion that are disposed opposite to and spaced apart from each other. The deformation member is disposed between the first side wall portion and the second side wall portion. When outer sides of the first side wall portion and the second side wall portion are subjected to an opposing compression force applied along a spacing direction between the first side wall portion and the second side wall portion, at least one of the first side wall portion or the second side wall portion deforms, and the first side wall portion and the second side wall portion jointly compress the deformation member such that the deformation member bends laterally in the spacing direction. The sensor is disposed in a bending region of the deformation member, and generates an electrical signal when a bending degree of the bending region is greater than a preset bending threshold. In this way, the touch-control accuracy of the earphone can be effectively enhanced and the anti-interference capability of a touch-control function of the earphone can be effectively improved. In addition, the touch-control sensitivity of the earphone can be effectively improved while the manufacturing cost of the earphone can be effectively reduced.

The present disclosure provides an earphone including a sound generating unit, an abutment unit, and an ear hook. The ear hook has a symmetry plane along a length direction of the ear hook. The abutment unit includes a first housing and a first microphone. The sound generating unit includes a second housing and a second microphone. The earphone further includes a processing circuit configured to perform noise reduction processing based on a first sound and a second sound. The earphone further includes a first reference plane located below the symmetry plane and parallel to the symmetry plane in a wearing state. A distance from the first reference plane to the symmetry plane is less than or equal to 5 mm. A first sound inlet includes a sound inlet end located on an outer wall surface of the first housing. The sound inlet end is entirely located on a side of the first reference plane facing the symmetry plane.

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The present disclosure relates to an acoustic output device. The acoustic output device comprises a housing and an air-conduction vibrator. The air-conduction vibrator is disposed in the housing. The housing includes a first acoustic chamber and a second acoustic chamber. The first acoustic chamber and the second acoustic chamber are located on two sides of a diaphragm of the air-conduction vibrator, respectively. The housing is provided with a sound outlet hole and a first pressure relief hole. The sound outlet hole is in communication with the first acoustic chamber, and the first pressure relief hole is in communication with the second acoustic chamber.