Struktur und Verfahren zur Heilung des Tunneldielektrikums von nichtflüchtigen Speicherzellen
Anmelder: NXP USA, Inc., Freescale Semiconductor, Inc. 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP2620945
- Aktenzeichen
- EP13151698
- Anmeldetag
- 17. Januar 2013
- Veröffentlichung
- 13. März 2019
- Erteilung
- 13. März 2019
- Rechtsraum
- EP
- IPC
- G11C16/34G11C16/04H01L29/792// H01L21/28H01L21/3105
Abstract
A semiconductor device comprises an array (12) of memory cells (18). Each of the memory cells includes a tunnel dielectric (26), a well region including a first current electrode (28) and a second current electrode (30), and a control gate (20). The first and second current electrodes are adjacent one side of the tunnel dielectric (26) and the control gate is adjacent another side of the tunnel dielectric. A controller (16) is coupled to the memory cells (18). The controller (16) includes logic to determine when to perform a healing process in the tunnel dielectric (26) of the memory cells (18), and to apply a first voltage to the first current electrode (28) of the memory cells (18) during the healing process to remove trapped electrons and holes from the tunnel dielectric (26).
Anmelder
- Firmen
- NXP USA, Inc.
Freescale Semiconductor, Inc. - Land
- 🇺🇸 USA
US-amerikanische Gesellschaft des Halbleiterkonzerns NXP, die Chips und Halbleiterlösungen für Automobiltechnik, Kommunikation und Industrieelektronik entwickelt.
1.545 Patente in unserer Datenbank
-
Pomper, Till
NoneToulouse
-
Potts, Susan Patricia
NoneBasingstoke