Melexis Technologies Patente

A sensor device (300) comprising: a first set of nodes connectable to a first set of sensors (310), a forward signal path (323) comprising: an analog circuit (ASP, 311) comprising at least one amplifier; a digitizer circuit (312) for providing digital values (dv); a digital processing circuit (DSP, 313); a digital-to-analog conversion circuit (317) for generating analog test signals (ats) based on digital test values (dtv) provided by a diagnostic controller (316); a multiplexer (318) for selectively routing signals (ss1) from the first set of input nodes to the ASP (311) in a first mode, and for routing the analog test signal (ats) to the ASP (311) in a second mode; the DSP being configured to analyse the digital values (dv) and/or to determine an angle or a phase. The sensor device may further comprise a second set of nodes connectable to a second set of sensors, and/or said sensors.

This invention provides a method and device for controlling brushless direct current (BLDC) motors, enabling smooth transitions between open loop control at low speeds and closed loop control at higher speeds. The device integrates modules for driving, observing, and transitioning between open and closed loop IB (current and back electromotive force) angles. A weighted average of the IB angles ensures stable motor performance during transitions, minimizing torque shocks, current spikes, and noise. The device also features current and voltage regulation to maintain accurate motor speed under varying conditions. Dynamic adjustment of weighting factors based on motor speed and signal-to-noise ratio further enhances control stability. This system improves motor efficiency in motor driving, reduces the risk of stalling, and optimizes performance across a wide range of operating speeds.

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An evaluation and control unit (100) for a broadband lambda probe (200) and a method for operating the same are disclosed. The evaluation and control unit (100) comprises pins (RE, IPE, APE, MES) connectable to electrical wires (201, 202, 203, 204) of electrochemical cells (210, 211) of the broadband lambda probe (200), a controller (103), a ASIC reference potential source (102), wherein the ASIC reference potential source (102) is operable by means of the controller (103), a switch assembly (104) connected to each of the pins (RE, IPE, APE, MES), wherein the switch assembly (104) comprises a first transistor (Twire) and a second transistor (T<ECU>), wherein the switch reference potential source (105) is connected to a gate side of the first and second transistors (T<Wire>, T<ECU>), wherein the controller (103) is configured to vary the switch reference potential (Vsw) applied to the gate side of the first and second transistors (T<Wire>, T<ECU>), wherein the switch assembly (104) is configured to allow a limiting current flowing to the drain side of the first transistor (T<Wire>) from the ASIC reference potential if the potential at the gate side of the first and second transistors (T<Wire>, T<ECU>) is at a predetermined voltage between values of an open and closed switch.

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A method of manufacturing a sensor device comprising: configuring a moulding support structure and a packaging mould so as to provide predetermined pathways to accommodate a moulding compound, the moulding support structure defining a first notional volume adjacent a second notional volume. An elongate sensor element and the moulding support structure are configured so that the moulding support structure fixedly carries the elongate sensor element and the elongate sensor element resides substantially in the first notional volume and extends towards the second notional volume, the elongate sensor element having an electrical contact electrically coupled to another electrical contact disposed within the second notional volume. The moulding support structure carrying (102) the elongate sensor element is disposed within the packaging mould (106). The moulding compound is then introduced (110) into the packaging mould during a predetermined period of time (112) so that the moulding compound fills the predetermined pathways, thereby filling the second notional volume and surrounding the elongate sensor element within the second notional volume without contacting the elongate sensor element.

A sensor arrangement for measuring a force is provided. The sensor arrangement comprises two or more soft sensor elements and a body, wherein the two or more soft sensor elements are at least partially located within the body and wherein the body comprises one or more openings. A contact portion of each of the two or more soft sensor elements extends through the one or more openings in the body, and the body is at least partially made of a material limiting the deformation of the contact portion of each of the two or more soft sensor elements when a force is applied to the sensor arrangement. Further, a method for manufacturing a corresponding sensor arrangement is provided.

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A sensor device for determining an orientation (α,β,ϕ,ψ) of a magnet (701) that is pivotable about a reference point (Pref), the sensor device comprising a semiconductor substrate (703) comprising a first and a second magnetic sensor (51, 52) spaced apart in a first direction (X), each configured for measuring a first magnetic field component (Bx1, Bx2) oriented in the first direction (X), and a second magnetic field component (By1, By2) oriented in a second direction (Y); wherein the sensor device further comprises a processing circuit configured for determining: i) a first magnetic field gradient (dBx/dx); ii) a second magnetic field gradient (dBy/dx); iii) a first angle (α,ψ) based on the first magnetic field gradient (dBx/dx); iv) a second angle (β,ϕ) based on the second magnetic field gradient (dBy/dx). A sensor system comprising said sensor device and said magnet.

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