Toppan Printing Patente

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A decorative material (10) includes a substrate (7), and a decorative sheet (1) laminated on one surface of the substrate (7). The decorative sheet (1) includes a substrate layer (2), an aggregate layer (3), a print pattern layer (4), and a surface protective layer (5). The aggregate layer (3) contains a mixture of an acrylic resin and an inorganic filler such that a mixing ratio of the acrylic resin with respect to 100 mass% of the aggregate layer (3) is in a range of 5 mass% or more and 15 mass% or less and a mixing ratio of the inorganic filler with respect to 100 mass% of the aggregate layer (3) is in a range of 85 mass% or more and 95 mass% or less. The aggregate layer (3) has a thickness in a range of 0.2 mm or more and 4.0 mm or less. The inorganic filler contains a filler having a particle size distribution in a range of 50 µm or more and 500 µm or less.

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A sealant film la includes a recycled material-containing layer 2 containing a recycled material that contains two or more types of resins, and a sealant layer 3 laminated on one main surface of the recycled material-containing layer. The recycled material-containing layer 2 includes a domain whose transmitted brightness is lower than that of the surrounding domain when the sealant film is observed in plan view, and the domain has a maximum area of 1,000 µm<2> or less and a maximum aspect ratio of 10 or less.

A gas barrier laminate according to an aspect of the present disclosure includes at least a paper substrate, a first resin layer, and a gas barrier layer in this order, in which in the paper substrate, the proportion of pulp having a length of 0.4 mm or more and 1 mm or less is 60% or more, and a proportion of pulp having a width of 10 µm or more and 20 µm or less is 40% or more.

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The present invention is an IC module (20) including: a substrate (21) having a through hole (26); a contact terminal (29) provided on a first surface (21f) of the substrate (21); an IC chip (22) provided on a second surface (21g) of the substrate (21); a holding portion (25) fixed to the substrate (21) and projecting from the substrate (21); and a fingerprint sensor (24) fixed to the holding portion (25), wherein the contact terminal (29) is electrically connected to the IC chip (22) via the through hole (26), and the fingerprint sensor (24) is electrically connected to the IC chip (22) via the holding portion (25).

A power storage device packaging material at least includes a substrate layer, a barrier layer including a metal layer, an adhesive layer, and a sealant layer in this order. The adhesive layer contains a hydrophobic insulating inorganic filler. The content of the hydrophobic insulating inorganic filler in the adhesive layer may be 0.5 to 20 mass%.

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A well counting device comprises an image acquisition unit that acquires one or more images of a plurality of wells capturing a target substance; and a counting unit that counts the number of wells emitting fluorescence among the plurality of wells for each of the one or more images acquired by the image acquisition unit, wherein the counting unit counts the number of wells emitting fluorescence, excluding a well that also emits fluorescence in adjacent wells, among the plurality of wells.

A sheet region of a light control sheet has an insulating portion in which a non-conductive portion of each of a first transparent electrode layer and a second transparent electrode layer that are a pair of transparent electrode layers, is located, and a light control unit in which a conductive portion of each of the first transparent electrode layer and the second transparent electrode layer that are the pair of transparent electrode layers, is located and that is divided by the insulating portion. A second end region has a bridge portion that is connected to the light control unit and extends in a strip shape along an outer edge of the light control sheet, and a second connection portion that extends from the bridge portion and is configured to be connected to a second wiring portion. The conductive portion of the second transparent electrode layer is located in each of the bridge portion and the second connection portion.

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An IC module according to the present invention includes a rectangular substrate having long sides extending in a first direction; a connection coil formed in a spiral shape on a first surface of the substrate; an outermost connection terminal portion formed at an outermost end of the connection coil; and an IC chip provided on a portion of the first surface on an inner peripheral side relative to the connection coil, wherein the outermost connection terminal portion includes an outermost through-hole portion penetrating the substrate in a thickness direction of the substrate, and an outermost land portion surrounding the outermost through-hole portion and connecting between the outermost through-hole portion and the connection coil; and as viewed in a second direction perpendicular to both the first direction and the thickness direction, the outermost connection terminal portion is disposed on a first side in the first direction relative to the IC chip.

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