Denso

A position detection device includes a substrate (100) arranged facing a detection body (30), a transmitting coil (110) formed on the substrate, a first receiving coil (120) and a second receiving coil (130) arranged inside the transmitting coil in a normal direction, and a plate-shaped accommodation portion (500) that accommodates the substrate and has a plate thickness direction in the normal direction. The accommodation portion has an arrangement part (511) in which the substrate is arranged and a mounting part (512) for mounting the accommodation part. The accommodation portion has a connecting part (513) that connects the mounting part and the arrangement part. The connecting part has at least one of two structures: a structure in which a size in the first direction is smaller than that of the arrangement part, and a structure in which a size in the third direction is smaller than that of the arrangement part. The arrangement part has a rigid portion (600, 610, 620, 630, 631, 632, 633, 634, 635, 636, 637) that is formed to be larger in size in the plate thickness direction than other portions of the arrangement part.

A semiconductor device (1) includes a semiconductor module (4), a component-embedded substrate (3), a support substrate (2) on which these components are mounted, and a wiring layer (7). The component-embedded substrate includes an electronic component (31, 32). The component-embedded substrate has a height equal to a height of the semiconductor module, and the electronic component has a height different from the height of the semiconductor module. The wiring layer includes wiring sections (72) each electrically connected to the power semiconductor element or the electronic component. The wiring layer is disposed on an opposite side of the semiconductor module and the component-embedded substrate from the support substrate. The electronic component has a terminal (311, 312) connected to a corresponding wiring section among the wiring sections. The terminal is positioned closer to the wiring layer than to the support substrate.

A recognition device (201, 202) includes a feature region detection unit (21) and a representative point extraction unit (23). The feature region detection unit detects at least three feature regions (62) of a target from image data (67). The representative point extraction unit calculates at least three extracted representative points from the at least three feature regions, and extracts label information (68) identifying the at least three extracted representative points. The position estimation unit estimates a position of the target based on the at least three extracted representative points and at least three reference representative points which have a predefined correct positional relationship with each other and have reference label information identifying each of the at least three reference representative points.

A position detection device includes a substrate (100) disposed to face a displaceable detection object, a transmitting coil (110) provided in the substrate (100), a first receiving coil (120) and a second receiving coil (130) which are disposed inside the transmitting coil (110) in a normal direction with respect to a surface direction of the substrate (100), and a signal processing unit (210) that derives a displacement amount of the detection object (30) in view of a gap between the detection object and the substrate (100), based on a first characteristic value of the first receiving coil (120) and a second characteristic value of the second receiving coil (130).

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Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

Zusammenfassung wird geladen …