Eagle Technology

Systems and methods for providing a truss structure. The methods comprise: increasing a distance between a first end fitting coupled to a first node and a second end fitting coupled to a second node by actuating a flexure member to cause cup member of first end fitting to move in a first direction toward the first node; inserting a tube between the first and second end fittings; receiving a first end of the tube in an insert space of the second end fitting; decreasing the distance between the first end fitting and the second end fitting by actuating the flexure member to cause at least the cup member of the first end fitting to move in an opposing second direction away from the first node; and receiving a second end of the tube in an insert space of the first end fitting to provide a portion of the truss structure.

An apparatus 20 for making a multi-layer capacitive device 40 may include a deposition chamber 21 and a conductive material source 22 within the deposition chamber. The apparatus 20 may also include a dielectric material source 23 within the deposition chamber 21 and a micro-electromechanical system (MEMS) deposition shadow mask 30 within the deposition chamber. The apparatus 20 may also include a controller 35 outside the deposition chamber 21 and configured to selectively operate the conductive material source 22 and the dielectric material source 23 and operate the MEMS deposition shadow mask 30 adjacent a substrate 25 within the deposition chamber to selectively deposit alternating conductive material and dielectric material layers onto the substrate to make the multi-layer capacitive device 40.

An integrated circuit (IC) assembly 50 may include stacked IC die 51a-51e and a respective interposer 20 between adjacent ones of the stacked die. Each interposer 20 may include an interposer bottom 21 and an interposer top 22 coupled thereto and defining a heat exchange fluid chamber 23 therebetween. Each interposer may also include interposer dielectric pillars 24a, 24b extending within the heat exchange fluid chamber 23 between the interposer bottom 21 and the interposer top 22, and a heat exchange fluid 25 within the heat exchange fluid chamber. Each interposer 20 may also include a wick structure 26 within the heat exchange fluid chamber 23 for moving the heat exchange fluid 25 in a liquid phase into the heat exchange fluid chamber 23, and electrically conductive through-vias 27 extending within respective ones of the interposer dielectric pillars 24a, 24b and being exposed on outer surfaces of the interposer bottom 21 and the interposer top 22.

An interposer 20 for an integrated circuit (IC) device may include an interposer bottom 21 and an interposer top 22 coupled thereto and defining a heat exchange fluid chamber 23 therebetween. The interposer 20 may also include interposer dielectric pillars 24a, 24b extending within the heat exchange fluid chamber 23 between the interposer bottom 21 and the interposer top 22, and a heat exchange fluid 25 within the heat exchange fluid chamber. The interposer 20 may also include a wick structure 26 within the heat exchange fluid chamber 23 for moving the heat exchange fluid 25 in a liquid phase into the heat exchange fluid chamber, and electrically conductive through-vias 27 extending within respective ones of the interposer dielectric pillars 24a, 24b and being exposed on outer surfaces of the interposer bottom 21 and the interposer top 22.

A spacecraft 20 includes a spacecraft package 22 movable between stored and deployed positions. A rope 28 may secure the spacecraft package 22 in the stored position. The rope 28 may have a first end 28a and a second end 28b opposite the first end. A tension lock 50 may be coupled to the first end 28a of the rope 28 to maintain the rope at an initial tension. A take-up mechanism 54 may be adjacent the first end 28a of the rope 28. A melting blade 66 may be selectively operable to melt and sever the rope 28 adjacent the second end 28b thereof so that the rope is released at the second end, retrieved onto the take-up mechanism 54, and the spacecraft package 22 is released from the stored position to move to the deployed position.

A Rydberg sensor 320 may include an array of Rydberg quantum radio frequency (QRF) cavities 345 arranged in rows 323a and columns 323b. A probe laser source 334 may be configured to generate a time delayed probe beams 325 for respective ones of the rows 323a of Rydberg QRF cavities 345. An RF signal source may be configured to generate time delayed RF signals 324 for respective ones of the columns 323b of Rydberg QRF cavities 345.

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