Northrop Grumman

A reciprocal quantum logic (RQL) gate circuit has a first stage having four logical inputs asserted based on receiving positive single flux quantum (SFQ) pulses and storing the SFQ pulses in respective storage loops each associated with a logical input, and a second stage having two more storage loops. First and second logical decision Josephson junctions (JJs) make determinations based on signals stored in the first-stage storage loops. A third logical decision JJ makes a third determination based on the first and second determinations. Each logical decision JJ triggers based on biasing provided by one or more currents stored in its associated storage loops and a bias signal having an AC component. The second stage asserts an output based on the triggering of the third logical decision JJ. Four-input AND, OR, AO22, and OA22 gates are thereby provided.

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A superconducting AC switch system (10, 30) includes a switch network configuration (12, 40, 60, 90, 130) comprising a Josephson junction (JJ, 18) coupled to a transmission line (42, 62, 92, 132) having a transmission line impedance, and a magnetic field generator (16, 32) that is configured to switch from inducing a magnetic field in a plane of the JJ, and providing no magnetic field in the plane of the JJ. An AC input signal (AC_SIG_IN) applied at an input of the switch network configuration (12, 40, 60, 90, 130) is passed through to an output of the switch network configuration (12, 40, 60, 90, 130) in a first magnetic state, and substantially reflected back to the input of the switch network configuration (12, 40, 60, 90, 130) in a second magnetic state. The first magnetic state is one of inducing and not inducing a magnetic field in a plane of the JJ, and the second magnetic state is the other of inducing and not inducing a magnetic field in a plane of the JJ.

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Methods for fabricating high-temperature composite structures (e.g., structures comprising carbon-carbon composite materials or ceramic composite matrix (CMC) materials and configured for use at temperature at or exceeding about 2000°F (1093°C)) include forming precursor structures by additive manufacturing ("AM") (e.g., "3D printing). The precursor structures are exposed to high temperatures to pyrolyze a precursor matric material of the initial 3D printed structure. A liquid resin is used to impregnate the pyrolyzed structure, to densify the structure into a near-net final shape. Use of expensive and time-consuming molds and post-processing machining may be avoided. Large, unitary, integrally formed parts conducive for use in high-temperature environments may be formed using the methods of the disclosure.