Beal, James Michael

A cooling system may include one or more coolant distribution units (CDUs) to regulate a distribution of a coolant and a secondary fluid network coupled to the CDUs. The secondary fluid network may include one or more main pipelines coupled to the CDUs, where the main pipelines may be arranged in a hot aisle formed by at least two rack rows including a plurality of racks. The secondary fluid network may include one or more branch pipes coupled to the main pipelines, where the branch pipes may be arranged with the hot aisle below the main pipelines. The secondary fluid network may include conduits to couple the branch pipes to the plurality of racks. The main pipelines may distribute the coolant from the CDUs to the branch pipes and the branch pipes may distribute the coolant to the plurality of racks via the conduits.

A power management system may include a power converter to provide output power to one or more loads from at least one of a primary power source or a backup power source, where the power converter is operable in at least a power smoothing mode, and where the power converter in the power smoothing mode shields the primary power source from periodic load swings by periodically charging and discharging the backup power source to compensate for the periodic load swings. The system may further include a controller including one or more processors configured to execute program instructions causing the one or more processors to generate state of charge measurements of the backup power source in the power smoothing mode based on a weighted combination of two or more state of charge measurement techniques.

The present disclosure provides a modular plinth system 200, comprising a plurality of plinth modules 201a, 201b, 201c, 201d, wherein each of the plurality of the Rectangular channel plinth module 201a, 201b, 201c, 201d are aligned adjacently at a predetermined distance from each other to form an outer frame structure of variable size, and wherein outer side wall of each of the plurality of the plinth module 201a, 201b, 201c, 201d include at least one plinth sliding slot 203. The system 200 further comprises a plurality of support brackets 202a, 202b, 202c, 202d, wherein each of the support brackets 202a, 202b, 202c, 202d includes a bracket sliding slot 204, and a bracket 205 with one or more fastening mechanism 206, wherein each of the support bracket 202a, 202b, 202c, 202d is placed over the outer side walls of two adjacently placed plinth modules 201a, 201b, 201c, 201d to align the at least one plinth sliding slot 203 with the bracket sliding slot 204, and fasten the at least one plinth sliding slot 203 with the bracket sliding slot 204 using the bracket 205 with the one or more fastening mechanism 206.

A power distribution unit includes: a backplane with backplane slots; a primary busbar having a least one primary faster hole on one end for fastening the primary busbar to the backplane; and a primary mounting plain extending perpendicularly from an opposing end with at least one primary slot therethrough. The power distribution unit further includes a central busbar having a central mounting plain extending perpendicularly from one end, mounted to the primary mounting plain, and a central slot therethrough on an opposing end. The power distribution unit also includes an ancillary busbar mounted to the central busbar around the central slot.

An apparatus for distributing electrical power and cooling fluid to a server in a server rack is disclosed. The apparatus includes first and second fluid pipes each formed of an electrically conductive material. The first and second fluid pipes include first and second electrical connections, respectively, of opposite polarities with respect to one another, such that when the first and second fluid pipes are electrically connected to respective ones of first and second electrical connections, the first and second fluid pipes act as first and second electrical terminals for the server. A coolant inlet pipe is configured to convey a non-electrically-conductive cooling fluid into the first fluid pipe. A coolant outlet pipe is configured to convey the cooling fluid from the second fluid pipe. A connecting pipe is configured to convey the cooling fluid from the first fluid pipe to the second fluid pipe, through the server.

The present disclosure is directed to a hybrid, indirect evaporative free cooling system that includes liquid cooling. The cooling system includes an air-to-air heat exchanger and a first water coil located beneath the air-to-air heat exchanger. The system further includes a first fan unit configured to draw air through the first water coil and the air-to-air heat exchanger in a first direction, wherein the first fan unit is further configured to exhaust air to a location external to the data center and a second fan unit configured to blow air from the data center, in a second direction perpendicular to the first direction, through the air-to-air heat exchanger. A coolant distribution unit is configured to provide cooling fluid to the first water coil.

A thermal management system that is configured to dynamically change polling rates of wireless sensors within a data center environment over time is described. Sensors that provide temperature, humidity, and dew-point readings are then used to cause a ramp up or a ramp down of cooling equipment within a data center environment, such that the cooling equipment can be more reactive to the changing overall usage of computing resources within the data center environment. As computing power used by the computing resources fluctuates at non-static rates within a data center, the thermal management system adjusts polling rates of the sensors as production cycles ramp up or down, thus making the overall data center environment more efficient.

The present disclosure is directed to devices for monitoring operating power distributed to information technology (IT) devices under particular operating conditions. One or more devices under test (DUT), e.g., data center components, are provided between a power source and a resistive load. Between the DUT and resistive load are provided one or more static switches and a controller. According to a desired load profile defined by parameters which may be set by a user or predetermined to match specific high-performance applications, the controller generates a load pattern including one or more pulsing trains simulating a pulsing current load characteristic of artificial intelligence (AI) or other high-performance applications. The controller drives the static switches to reproduce the load pattern so that the reactions of devices under test to the desired profile may be observed.

A cooling system can include a primary cooling loop having a primary cooling fluid, a secondary cooling loop having a secondary cooling fluid, a heat exchanger for transferring heat to the primary cooling fluid from the secondary cooling fluid, and a controller. The heat exchanger can be a brazed plate heat exchanger arranged for providing a low supply temperature of the secondary cooling fluid supplied to a load. The system can increase the supply temperature by injecting hot secondary cooling fluid upstream of the load, such as by using a bypass valve in the secondary cooling loop.

A liquid cooling system such as a liquid cooling distribution unit includes a liquid circuit for recirculating a cooling liquid, one or more liquid pumps, one or more liquid filters, pressure sensors, and a controller for determining differential pressures across the one or more liquid filters. In embodiments, the controller implements a filter health monitoring scheme for predicting the time for filter replacement, and in some embodiments, implements a low pump speed operating mode for system protection.