Analog Devices

First node signal-separation circuitry obtains first node electrical transmit signal (TX1) from a full-duplex electrical communication signal. First node transmit components convert TX1 to a first node optical transmit signal (OTX1) and send OTX1 over an optical link. Second node receive components receive OTX1 and convert it to a first node electrical transmit signal (TX1) at the second node. Second node signal-separation circuitry obtains a second node electrical transmit signal (TX2) from a full-duplex electrical communication signal of the second node. Second node transmit components convert TX2 to a second node optical transmit signal (OTX2) and send OTX2 over the optical link. First node receive components receive OTX2 from the optical link and convert it to TX2 at the first node. At each node the full-duplex electrical signal comprises a superposition of a locally transmitted electrical transmit signal and a counterpart electrical transmit signal received from the optical link.

Described herein are isolator devices designed to reduce cracking and mechanical stress despite the use of wire bonds made of hard materials (e.g., copper-based). The isolators employ thin film dielectric materials with high dielectric strength and permittivity underneath the top coil (electrode) to enhance the isolation of the device. However, these materials are susceptible to cracking. Described herein are designs in which the dielectric material is partially removed from the isolator. A dielectric layer may be kept in the region(s) where its large dielectric permittivity is particularly beneficial (e.g., near the edge of a coil) but may be removed from the region immediately underneath the bonding pad, where a large amount of pressure is applied during the bonding process. Optionally, a cushion layer is employed to absorb some of the energy produced during the bonding process.

A method and circuit arrangement for voltage protection is disclosed. In certain embodiments, a controllable switch comprises a control terminal, a first channel terminal, and a second channel terminal, and arranged to be switched between an off-state and an on-state. In the on-state the controllable switch allows a current to flow between the first channel terminal and the second channel terminal. An overvoltage protection circuit is configured to determine a voltage difference between a first voltage of the first channel terminal and a second voltage of the second channel terminal. The overvoltage protection circuit also sets a control signal to a protection value to operate the controllable switch in the off-state in response to determining that the voltage difference is greater than or equal to a switch threshold.

A method of manufacturing a vertical inductor, the method comprising: forming a substrate, forming a bottom electrode, forming a dielectric layer, forming a magnetic core, forming insulation layer, forming a conductive loop structure by extending vertical interconnects through the insulation layer from a first side of the magnetic core to a second side of the magnetic core, electrically connecting the vertical interconnects to the bottom electrode on the second side of the magnetic core.

The present disclosure relates to a DC-DC power converter and method of operation. The converter comprises a first converter circuit for controlling a first output current and a second converter circuit for controlling a second output current. The first converter comprises a first plurality of switches coupled to a first terminal of the DC-DC power converter and a first inductive impedance coupled to the first plurality of switches and a second terminal of the DC-DC power converter. The second converter circuit comprises a second plurality of switches coupled to the first terminal of the DC-DC power converter and a second inductive impedance coupled to the second plurality of switches the second terminal of the DC-DC power converter. The DC-DC power converter also comprises first and second capacitors, each cross-coupled between the first converter circuit and the second converter circuit.

A method and circuit arrangement for a solid state switch device is disclosed. In certain embodiment, a solid state switch device comprising a controllable switch comprising a control terminal, a first channel terminal, and a second channel terminal, and arranged to be switched between an off-state and an on-state, wherein in the on-state the switch allows a current to flow between the first channel terminal and the second channel terminal. The solid state switch device further comprising: a first compensation circuit configured to: generate a first boost current based on a voltage difference between the first channel terminal and the second channel terminal; and apply the first boost current to the control terminal to charge a switch capacitance of the controllable switch.

Aspects of the present disclosure include a detection system, a method, and/or a base node for providing the electrical energy to a plurality of edge nodes, transmitting a sensor interrogation signal to at least one of the plurality of edge nodes in the detection system, receiving, in response to the sensor interrogation signal, sensor information, send the sensor information to a predictor configured to: receive sensor training data, train an artificial intelligence engine using the sensor training data, identify an anomaly and an action associated with the anomaly based on providing the sensor information to the artificial intelligence engine, and provide the action, and performing the action provided by the predictor.

Power modules with enhanced thermal conductivity are disclosed herein. In certain embodiments, a power module includes a circuit board, an inductor component attached to a first or top side of the circuit board, and a semiconductor die attached to a second or bottom side of the circuit board opposite the first side. The power module further includes a thermally conductive wrap at least partially around a dielectric body of the inductor component. The thermally conductive wrap serves to transfer heat from the semiconductor die to a cold plate or heat sink that can be attached to the inductor component opposite the circuit board.

An inductive circuit includes a coupled inductor including a magnetic core including a first core rail, a second core rail, and multiple identical core legs between the first core rail and the second core rail, wherein the core legs include an identical gap; multiple identical inductive phase stages, wherein each inductive phase stage includes a core leg and an identical phase winding around the core leg, wherein each phase winding includes a first terminal connected to the input node and a second terminal connected to the output node; and an inductive linking stage identical to the multiple inductive phase stages, wherein a first terminal of a phase winding of the inductive linking stage is connected to the input node and a second terminal of the phase winding of the linking stage is connected to the linking inductance node.

Surface temperatures for battery cells in a battery pack can be inferred or estimated using internal or core temperatures of the battery cell and a thermal model. The internal temperature may be generated using electrochemical impedance spectrometry (EIS). Delta values from the EIS estimations to the cell surface temperature may be generated based on a thermal model of the battery. The thermal model of the battery may be created using probe points on the surface of a test battery, such as thermocouples.