Sungrow Power Supply

The present application discloses a heat dissipation apparatus, a heat sink and an electrical device. The heat dissipation apparatus includes a heat sink and a first bursting component, the heat sink has a heat-exchange medium channel, the first bursting component is provided on the heat sink and is in communication with the heat-exchange medium channel. When a temperature of the heat-exchange medium rises to a set value (a pressure of the heat-exchange medium rises to a bursting pressure of the first bursting component), the first bursting component breaks out. A spot bursting can be realized by setting the location of the first bursting component, and an orientated bursting can be realized by setting the orientation of the first bursting component, so that foreign matters or shock waves generated by bursting can be far away from a specific device or a specific area, thereby reducing the damage to the specific device or a personnel at the specific area. Therefore, the heat dissipation apparatus can reduce the damage caused by bursting.

A control method and a related apparatus are provided. The control method includes: determining actual maximum power limits of the multiple power units, in a process of the multiple power units outputting power with maximum output capacities; and issuing target unit power to the multiple power units respectively, based on the actual maximum power limits of the multiple power units; where the target unit power of each of the multiple power units is less than or equal to the actual maximum power limit of the power unit. The control method and the related apparatus can improve the rationality of power output distribution within the energy system.

A heat dissipation and flow guiding mechanism and a cabinet having the same are provided. The heat dissipation and flow guiding mechanism is configured for guiding a heat flow generated by an electrical device (10) and includes: a first enclosure structure (20) having a first accommodation cavity (22), and a second enclosure structure (30) located above the first enclosure structure (20) and having a flow guiding cavity (31). The first accommodation cavity (22) has a first opening (21) and is configured for mounting the electrical device (10), and the first accommodation cavity (22) is in communication with the flow guiding cavity (31) through the first opening (21). According to the present application, the influence of heat generated by a transformer in an exposed state in the related art on peripheral devices is effectively improved, and the heat dissipation capability of a transformer and an integrated all-in-one machine is further improved.

A power converter, a method for controlling a power converter, and a power supply system are disclosed. The power converter comprises a power converting circuit and a shunt branch. A first terminal of the shunt branch is connected to an output terminal of the power converting circuit. A second terminal of the shunt branch is connected to a DC positive or negative input terminal of the power converting circuit. The shunt branch is configured to shunt a current flowing from the output terminal of the power converter circuit to the DC positive input terminal of the power converting circuit, or a current flowing from the DC negative input terminal of the power converting circuit to the output terminal of the power converter circuit, in response to the input terminal of the power converting circuit being short-circuited.

An inverter, a short-circuit protection method for the inverter, and an energy system are provided. The inverter includes: a DC bus, configured to connect a DC source, where a semiconductor component is connected between the DC source and the DC bus; an inverter circuit, where a DC side of the inverter circuit is connected to the DC bus, an AC side of the inverter circuit is configured to connect a power grid via a designated relay; and a controller, configured to turn off the designated relay within a safe current breaking period of a short-circuit condition, in response to the short-circuit condition in which a DC line between the semiconductor component and the DC source is short-circuited to ground, or the DC source is short-circuited to ground, where during the safe current breaking period, a short-circuit current is 0 or less than a breaking current of the designated relay.

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Zusammenfassung wird geladen …

Zusammenfassung wird geladen …

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