Universität Heidelberg

A single photonic integrated circuit (PIC) comprising a first splitter for receiving light from a light source and dividing and distributing the light along N separate light pathways, wherein N is an integer larger than one, the PIC further comprising a first modulator unit disposed on each of the N light pathways for adjusting a phase and/or an amplitude of light in each of the light pathways.

The present invention relates to a method of producing a three-dimensional structure, the method comprising the following steps: A) providing a photopolymerizable composition comprising a photopolymerizable monomer, a Lewis acid, a photoinitiator, and an optional additive; and B) printing the three-dimensional structure by means of multi-photon polymerization of the photopolymerizable composition provided in step A).

The present invention relates to a hydrogel-based polymeric 3D-scaffold, wherein the hydrogel comprises a caspase-cleavable peptide that is functionalized by a fluorescence resonance energy transfer (FRET) pair, wherein the FRET acceptor of the FRET pair stops and the FRET donor of the FRET pair starts or increases emitting fluorescence when the caspase-cleavable peptide is cleaved by a caspase.

Computer system (100) and computer-implemented method are provided for automated generation of manufacturing-machine control data (291) for the manufacturing of an orthodontic appliance (280) for a patient (2). Based on three-dimensional representations (210) of the patient's oral anatomy and an appliance type (211) of the orthodontic appliance, the system generates a control structure (111) comprising a mesh providing an initial representation (111pi) of an aimed appliance geometry, and subdivision manifold-related shape attribute information (Ills) with a subdivision scheme, implicit manifold-related shape attribute information (111i) with a scalar field, and information for evaluating a respective position of the respective vertex. Executing a subdivision according to the subdivision scheme generates a modified control structure (111m). For added vertices, respective shape attribute information is evaluated to obtain the position of the respective vertices. Once a final mesh is obtained, it is transformed into manufacturing-machine control data for the manufacturing of the orthodontic appliance, and provided to corresponding manufacturing means (290).

The invention relates to a method of manufacturing a photonic integrated circuit, comprising: providing a wafer comprising a first layer (S1); coating the first layer with a soft resist (S2); patterning a pattern for one or more photonic components on the soft resist (S4); and dry etching the one or more photonic components in the first layer (S6).

The invention relates to A Photonic Integrated Circuit, PIC, comprising: a PIC connector for optical coupling of the PIC to a corresponding connector, the corresponding connector comprising a plurality of optical fibers, wherein the PIC connector comprises: a plurality of optical couplers, each optical coupler of the plurality of optical couplers being configured to optically couple to a corresponding optical fiber of the plurality of optical fibers; a PIC alignment structure configured to engage with a corresponding alignment structure of the corresponding connector so that, when the PIC alignment structure is engaged with the corresponding alignment structure, each optical coupler is aligned with the corresponding optical fiber of the plurality of optical fibers to enable an optical coupling between each optical coupler and the corresponding optical fiber of the plurality of optical fibers

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