Samsung Electronics

A system (100) and a method are disclosed for wireless communication. The method includes transmitting, by a first access point, AP (101), capability information indicating one or more multi-access point coordination, MAPC, schemes; and transmitting, by the first AP (101), an MAPC negotiation indication indicating an enabled state or a disabled state for MAPC negotiation.

A device, system, and method are disclosed for efficiently enabling Processing-in-Memory, PIM, or processing-near-memory, PNM, compression on mobile systems on a chip, SoC. In an embodiment, a memory device (310) includes a cryptographic engine, CE (316), wherein the memory device (310) is configured to receive encrypted data via a memory input/output, IO, bus (320), and the CE (316) is configured to decrypt the encrypted data to obtain decrypted data. The memory device (310) can further comprise a PIM or PNM device (314) configured to process the decrypted data.

Methods and devices are provided in which a volume manager determines a bucket of a variable-granularity volume map, VVM, for block volume storage, based on a corresponding volume logical block address, vLBA, set; and determines an entry for the vLBA set in the VVM or a fine-grained volume map, FVM, for the block volume storage, based on the determined bucket comprising at least one empty entry or entries of the VVM occupied, wherein the FVM comprises a higher granularity than the VVM.

A device, system, and method are disclosed for processing-in-memory, PIM, compression. In an embodiment, a method includes obtaining, by an input/output sense amplifier, IOSA (204), from an associated RAM bank (202), compressed data (702); sending, by the IOSA (202), the compressed data (702) divided into a plurality of portions (704); receiving, by a respective decompressor of a plurality of decompressors (306) of a PIM block (212) associated with the RAM bank (202), a respective portion of the compressed data (702); decompressing, by the respective decompressor, the respective portion of the compressed data to obtain a respective portion of decompressed data; and sending, by the respective decompressor, the respective portion of the decompressed data to a respective Arithmetic Logic Unit, ALU, of a plurality of ALUs (308) of the PIM block (212) for processing.

An integrated circuit is provided. The integrated circuit includes: a voltage-dividing circuit including a plurality of resistors connected to each other in series, wherein the voltage-dividing circuit is configured to generate, based on a test signal, an internal test signal, at least one first reference signal, and at least one second reference signal; a first low-pass filter configured to receive the at least one first reference signal and generate a first reference voltage; a second low-pass filter configured to receive the at least one second reference signal and generate a second reference voltage; a first comparator configured to compare the first reference voltage to the internal test signal; and a second comparator configured to compare the second reference voltage to the internal test signal.

A circuit device (100) includes a semiconductor substrate (102) having a first transistor structure (104). The first transistor structure includes at least one first channel region (106) extending between first source/drain regions (108), first source/drain contacts (110) on the first source/drain regions, respectively, and a first gate (112) on the at least one channel region between the first source/drain contacts. A first spacer (115) electrically isolates one of the first source/drain regions from one of the first source/drain contacts thereon. Related devices and fabrication methods are also discussed.

Semiconductor devices and methods of manufacturing the semiconductor devices are provided. For example, a semiconductor device (1) may include: a stack of semiconductor layers including a first semiconductor layer (200B), and a second semiconductor layer (200C) stacked on the first semiconductor layer (200B) in a first direction (Z); a heat sink (300) stacked on the second semiconductor layer (200C) in the first direction (Z); and a heat pipe (100) that extends in the first semiconductor layer (200B), the second semiconductor layer (200C), and the heat sink (300) in the first direction (Z).

An example capacitor structure includes a lower electrode structure (70), a dielectric pattern (95) and an upper electrode (105). The lower electrode structure (70) includes a first lower electrode (65) on a substrate (10), and a second lower electrode (62) on a sidewall of the first lower electrode (65). The second lower electrode (62) includes an alloy of a first metal and a second metal. The dielectric pattern (95) is disposed on a surface of the lower electrode structure (70). The upper electrode (105) is disposed on a surface of the dielectric pattern (95). The second lower electrode (62) has a thickness varying in a vertical direction perpendicular to an upper surface of the substrate (10). A weight ratio between the first metal and the second metal is uniform in the vertical direction in the second lower electrode (62).

A storage device includes a nonvolatile memory device including an input/output register, the nonvolatile memory device sensing data from a memory region corresponding to an address and transmitting the data that is sensed from the memory region, and a storage controller that transmits a command and the address to the nonvolatile memory device via a first bus and that transmits and receives data to and from the nonvolatile memory device via a second bus. The nonvolatile memory device, in response to a first command that is received from the storage controller, outputs a sensing status of first data and stores the first data in the input/output register.

A system and a method are disclosed for coordinating for a coordinated beamforming, Co-BF, in an overlapping basic service set, BSS. The method includes detecting, with at least one of a first access point, AP, an overlapping BSS between a first AP (AP1) and a second AP (AP2) and transmitting, with the first AP (AP1), an indication of whether the first AP (AP1) received a cross-BSS channel state indicator, CSI, report (214c). The method also includes coordinating with the second AP (AP2) by the first AP (AP1), to perform a Co-BF based on the cross-BSS CSI report (214c).