NXP USA
🇺🇸 USA aktiv
US-amerikanische Gesellschaft des Halbleiterkonzerns NXP, die Chips und Halbleiterlösungen für Automobiltechnik, Kommunikation und Industrieelektronik entwickelt.
Vertretung
Kanzleien und Patentanwälte, die NXP USA in unserer Datenbank vertreten.
Mit Komplettzugriff sehen Sie die vollständige Vertretung inkl. aller Kanzleien und Patentanwälte.
Komplettzugriff erhaltenMit Komplettzugriff sehen Sie die vollständige Vertretung inkl. aller Kanzleien und Patentanwälte.
Komplettzugriff erhaltenPatentanmelder folgen
Erhalten Sie wöchentlich eine E-Mail, sobald neue Patente von NXP USA veröffentlicht werden.
Erfolgreich angemeldet!
Sie erhalten ab sofort wöchentliche Berichte zu neuen Patenten von NXP USA.
Patente
1.545 gesamt| Patent | |||
|---|---|---|---|
|
15.07.2026
Schnellabsetzschwellenschätzer für eine Aufschnittschneidemaschine
|
|||
|
Zusammenfassung
An electronic circuit includes a fast-settling threshold estimator for determining a fast-settling threshold voltage which includes a maximum peak detector that receives an analog signal containing digital data and produces an estimate of a maximum value of the analog signal; a differentiator that produces an output voltage responsive to a change in the estimate of a maximum value of the analog signal; a preselected voltage coupled to a comparator that outputs a pulse when the output voltage is greater than the preselected voltage; a minimum peak detector that produces an estimate of a minimum value of the analog signal; and an averaging circuit that produces a weighted average of the estimate of a maximum value of the analog signal and the estimate of a minimum value of the analog signal. In one embodiment, the fast-settling threshold estimator is coupled to a bit slicer and to a RF receiver. |
|||
|
15.07.2026
Dynamische Elementanpassung für Multibit-Digital-Analog-Wandler in Zeitkontinuierlichen Delta-Sigma-Modulatoren
EP4776514
Elektronik & Schaltungstechnik
|
|||
|
Zusammenfassung
A continuous-time delta-sigma modulator (CTDSM) system includes a quantizer, an update block, a switching block, a summation block, and a feedback path. The quantizer is configured to quantize an analog input signal into one or more thermometer-coded digital signals. The update block is configured to generate control signals based on the thermometer-coded digital signals. The switching block is configured to route the thermometer-coded digital signals to a plurality of digital-to-analog converter (DAC) elements based on the control signals. The plurality of DAC elements is configured to convert the thermometer-coded digital signals into analog outputs. The summation block is configured to combine the analog outputs from the plurality of DAC elements to produce a final analog output. The feedback path is configured to use the final analog output as a feedback signal for the CTDSM system. |
|||
|
15.07.2026
Pulsunterdrückungscrestfaktorreduzierung
|
|||
|
Zusammenfassung
A transmitter reduces the Crest Factor of an input signal by identifying potentially hidden peaks and by efficiently identifying the delay between an observed peak at a specified sampling rate and a corresponding true peak generated after upsampling. The transmitter rescales, based on a programmable rescaling parameter, a threshold for peak detection, and employs the rescaled threshold to identify one or more candidate peaks of the input signal. After the transmitter has rescaled the one or more candidate peaks based on the estimated fractional delay between the candidate peaks and the corresponding true peaks, the peaks are reevaluated based on the original threshold. |
|||
|
08.07.2026
Geformte Vorrichtungsverpackungen mit Kapazitiven Strukturen
|
|||
|
Zusammenfassung
One or more integrated capacitors can be formed within the molding material(s) of a molded electronic device package. An electronic device such as a semiconductor die is surrounded by a first volume of molding material and a first capacitor plate is formed on a top surface of the first volume of molding material above the electronic device. A second volume of molding material is formed above the first capacitor plate and a second capacitor plate is formed on a top surface of the second volume of molding material which separates the second capacitor plate from the first capacitor plate. |
|||
|
08.07.2026
Automobilradar mit Vererbter Apodisierungs-Spararray-Verarbeitung zur Schätzung der Ankunftsrichtung
|
|||
|
Zusammenfassung
A system and method is presented for determining a plurality of MIMO virtual antenna arrays. Each virtual antenna array of the plurality of MIMO virtual antenna arrays is associated with a subset of a plurality of transmit antennas (102) and a subset of a plurality of receive antennas (104). Signals received by the plurality of receive antennas are used to determine signal spectrums (208) for each MIMO virtual antenna array of the plurality of MIMO virtual antenna arrays. Each signal spectrum includes signal magnitude values and has associated angle values, wherein main lobe (210) positions of the signal spectrums of the plurality of MIMO virtual antenna arrays are at a same angle across all signal spectrums and sidelobe (212) positions of the signal spectrums are not at the same angle across all signal spectrums. A first combined MIMO virtual antenna array signal spectrum (409) is determined by combining minimum values of the signal spectrums at each angle value. The first combined MIMO virtual antenna array signal spectrum is used to detect an object. |
|||
|
08.07.2026
Impliziter Frequenzvervielfacher
EP4773504
Elektronik & Schaltungstechnik
|
|||
|
Zusammenfassung
Systems and methods for an implicit frequency multiplier are described. In some embodiments, an implicit frequency multiplier may include a cross-coupled oscillator having a transistor pair, a primary coil coupled to source terminals of the transistor pair, and a secondary coil magnetically coupled to the primary coil. In another embodiment, a method may include operating a cross-coupled oscillator having a transistor pair and extracting a harmonic component of a current flowing through the cross-coupled oscillator using a transformer coupled to source terminals of the transistor pair. |
|||
|
08.07.2026
System und Verfahren für Drahtlosen Kanalzugang
|
|||
|
Zusammenfassung
Embodiments of a wireless device, a wireless access point (AP), and a method for wireless communications are disclosed. In an embodiment, a wireless device includes a controller configured to map, based on station (STA) priority and latency consideration, downlink (DL) traffic of STAs to different transmit queues and to adjust Enhanced Distributed Channel Access (EDCA) parameters for the different transmit queues and a wireless transceiver configured to implement wireless channel access based on the adjusted EDCA parameters to communicate with the STAs. |
|||
|
08.07.2026
Halbleiterpackung und Verfahren zu Ihrer Herstellung
EP4773185
Halbleiter & Elektrische Bauelemente
|
|||
|
Zusammenfassung
The present specification relates to package semiconductor devices and methods of manufacture thereof. According to a first aspect of the present disclosure, there is provided a packaged semiconductor device comprising a semiconductor die, a first molding compound encapsulating the semiconductor die, a first set of interconnecting solder balls, at least one redistribution layer, such redistribution layer connecting the semiconductor die to the interconnecting solder balls. The packaged semiconductor device further comprises at least one channel extending from the at least one redistribution layer to an exterior of the packaged semiconductor device wherein the at least one redistribution layer comprises pipes coupled to the at least one channel, such pipes transporting steam or moisture or thermal fluids from the at least one channel to the at least one redistribution layer or from the at least one redistribution layer to the at least one channel. |
|||
|
08.07.2026
Verfahren für Anwendungsprogrammierschnittstelle (api) eines Softwaredefinierten Fahrzeugs (sdv)
EP4773009
Software & Datenverarbeitung
|
|||
|
Zusammenfassung
A method for implementing software defined vehicle, SDV, application programming interfaces, APIs, using an automotive open system architecture, AUTOSAR, classic platform, CP, is described. The method includes distributing SDV APIs on at least one client-server, C-S, interface located between: a SDV sensor software component, SWC, a SDV central compute unit, CCU, SWC, and a SDV actuator SWC. The method also includes developing an API-Data Distribution Service, DDS, transformer and mapping, by the API-DDS, the at least one C-S interface to DDS topics. |
|||
|
01.07.2026
Neuartige Ressourcenoptimierte Quellensynchrone Datenübertragung
|
|||
|
Zusammenfassung
An integrated circuit and associated method of operation are provided for a target component coupled over a bus having multiple data path lines and a clock path line to an initiator component which generates a plurality of data bit signals and a first clock timing signal for transmission in parallel over the bus, where the initiator component includes transmit circuitry to launch a first plurality of even data bit signals over a first subset of the plurality of data path lines in response to a rising clock edge of the first clock signal and to launch a second plurality of odd data bit signals over a second subset of the plurality of data path lines in response to a falling clock edge of the first clock signal. |
|||