SCREEN Holdings Patente

A technique disclosed in the specification of the present application is a technique of suppressing damage on an electrolysis cell in substrate processing. A substrate processing apparatus according to a technique disclosed in the specification of the present application includes a substrate processing part, a supply tank, a generation part, a collection part, a first supply route supplying a processing solution generated in the generation part to the supply tank, and a second supply route supplying the processing solution generated in the generation part to the collection part, and the collection part supplies a treated solution with which the processing solution supplied through the second supply route has been mixed to the generation part.

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A coating nozzle discharging a coating solution is moved to an upper side of a notch as a notched part of the substrate held in a stationary state. The substrate is rotated only once in a horizontal plane while the coating solution is discharged from the coating nozzle to form a coating film on an upper surface of a peripheral edge part of the substrate. The coating nozzle retracts when the coating nozzle is located on the upper side of the notch again. Application of the coating solution is started from the notch of the substrate, and is finished at the notch, thus the coating solution is applied only once to the peripheral edge part of the substrate, and the coating film with a narrow width can be formed. Overlapping of the coating solution does not occur in the notch, thus the coating film with a uniform width can be formed.

Provided is a technique of determining a printing method in consideration of quality of printing. A screen is regulated by page data, a range of a page in the screen is regulated by a page region, and the page data includes a content component arranged in the page region and regulating the content. A printing method determination method obtains a ratio of an area of the content component to the page region, and determines the printing method based on the ratio.

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A three-dimensional modeling apparatus (1) includes a material holding part (3), an optical head (2), and a control part (5). A control of the control part (5) is switchable between a first writing mode and a second writing mode. In the first writing mode, scanning of a light beam is performed only once at each position in a writing area on which writing is instructed by design data on a writing target layer. In the second writing mode, scanning of the light beam is performed a plurality of times at each position in the writing area in a state where the quantity of light applied to each position in the writing area in one scanning of the light beam is smaller than that in the first writing mode. It is thereby possible to form a modeled object with high accuracy.

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A substrate processing method includes a liquid film forming step of supplying a sublimable substance-containing liquid containing a sublimable substance to a front surface of a substrate W to form a liquid film of the sublimable substance-containing liquid on the front surface of the substrate W, a solidified film forming step of changing the liquid film of the sublimable substance-containing liquid into a solidified film SF containing the sublimable substance on the front surface of the substrate W, a sublimating step of sublimating the solidified film SF to remove the solidified film SF from the front surface of the substrate W, and a humidity increasing step of increasing humidity of an atmosphere in contact with the substrate W after sublimation of the solidified film SF is started.

Provided is a technology that can effectively reduce a pattern collapse ratio of a substrate. A method of processing a substrate includes a holding step, a liquid supplying step, a first drying liquid supplying step, a second drying liquid supplying step, and a drying step. In the first drying liquid supplying step, a first drying liquid having a first boiling point (bp1) and a surface tension lower than that of the processing liquid is supplied to a first main surface of the substrate. In the second drying liquid supplying step, a second drying liquid having a second boiling point (bp2) and a surface tension lower than that of the first drying liquid is supplied to the first main surface of the substrate. In the drying step, the substrate is dried. A second main surface of the substrate is heated to a first temperature in at least a part of a time in the first drying liquid supplying step, and at least a part of the second main surface of the substrate is heated to a second temperature, in at least a part of a time in the second drying liquid supplying step. A positive or negative sign of a value obtained by subtracting the second temperature from the first temperature is identical to a positive or negative sign of a value obtained by subtracting the second boiling point (bp2) from the first boiling point (bp1).

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