SCREEN Holdings Patente

A light wavefront measurement device includes a lens array, a light receiving sensor, and a wavefront shape calculation part. The lens array focuses measurement light for each region of the wavefront of the measurement light. The light receiving sensor receives multiple light spots focused by the lens array to output an electrical signal for pixels where the amount of received light has changed. The electrical signal indicates the direction of increase or decrease in the amount of received light and the time at which the amount of received light has changed. The wavefront shape calculation part calculates the wavefront shape of the measurement light, based on the electrical signal outputted from the light receiving sensor. The amount of information outputted from the light receiving sensor is smaller than that outputted for all pixels. The light receiving sensor is hence capable of outputting information about the displacement of the light spots with high time resolution. This allows the measurement of the wavefront shape of the measurement light with high time resolution, based on the information outputted from the light receiving sensor.

This observation apparatus 1 observes a particle trapped by a plurality of electrodes 72 extending in a direction crossing a channel 80 formed in a transparent substrate 9, and includes an imaging unit 31, a camera moving mechanism 32 that moves an imaged area of the imaging unit 31, and a control unit 10. The control unit 10 includes an end-electrode detection unit 511 that detects an end electrode 720a positioned at an end of the channel 80, an adjacent-electrode detection unit 512 that detects an adjacent electrode 720b adjacent to the end electrode 720a, a channel wall detection unit 513 that detects a sidewall 800w of the channel 80, and an observation position adjustment unit 514 that adjusts an observation position where the particle is observed, on the basis of the positions of the end electrode 720a, the adjacent electrode 720b, and the sidewall 800w. This enables proper alignment in observation of particles trapped in the vicinity of the electrodes 72 in the substrate 9 such as a micro-channel chip.

A substrate processing apparatus includes a nozzle device having a liquid discharger, a fluid supply system that supplies a processing liquid having a surface tension lower than that of a residual liquid to the nozzle device, a horizontal-direction driving device that moves the nozzle device to a plurality of different portions in a radial direction of a substrate in plan view while keeping the nozzle device at a position above the rotating substrate, and a controller that controls the fluid supply system and the horizontal-direction driving device according to a liquid processing condition. A liquid processing condition includes a liquid flow-rate condition that defines a flow rate of a processing liquid to be supplied to the nozzle device in each of the plurality of portions of the substrate, and a liquid movement condition that defines a movement speed of the nozzle device when the nozzle device moves to each of the plurality of portions of the substrate in order to supply the processing liquid to each of the plurality of portions of the substrate.

A brush device is attachable to and detachable from a brush holder. The brush holder is moved by a movement device. A brush of the brush device is pressed against an upper surface of a substrate held by a substrate holding device, and the substrate is cleaned. In a substrate cleaning device, with one brush device attached to the brush holder, another brush device is stored in a brush storage device. The brush holder is moved by a movement device to the brush storage device after an old brush device is detached. Another brush device is attached to the brush holder. The movement device includes an arm rotation driver and an arm movement driver that move the brush holder in two respective different directions.

A substrate processing method includes: a holding step of carrying a substrate into an inside of a chamber and holding said substrate; a supply step of supplying a fluid to the substrate on the inside of the chamber; an imaging step (S12) of sequentially imaging the inside of the chamber by a camera to acquire image data; a condition setting step (S11) of specifying a monitoring target from a plurality of monitoring target candidates in the chamber and changing an image condition based on the monitoring target; and a monitoring step (S13) of performing a monitoring process on the monitoring target based on the image data having the image condition corresponding to the monitoring target.

A substrate processing apparatus collectively processes a plurality of substrates with the plurality of substrates immersing in a processing liquid. The substrate processing apparatus includes a processing tank, a camera, and a controller. The processing tank stores the processing liquid. The camera is provided vertically higher above the processing tank and captures the inside of the processing tank to generate a plurality of items of captured image data. The controller generates smoothed image data obtained by smoothing a brightness distribution of waving caused on a liquid surface of the processing liquid based on integration of the plurality of items of captured image data, and monitors the inside of the processing tank based on the smoothed image data.

A temperature measurement wafer (1) includes a temperature sensor (3), a transmission unit (8), and a battery substrate (7). The transmission unit (8) wirelessly transmits temperature data of a temperature measurement subject measured by the temperature sensor (3) to the temperature measurement wafer (1). That is, the temperature measurement wafer (1) wirelessly transmits information to the outside, a decrease in operation efficiency caused by a communication wire can be avoided. The battery substrate (7) supplies power to each of the temperature sensor (3) and the transmission unit (8) using an all-solid-state secondary battery (21). Using the all-solid-state secondary battery (21) makes it possible to operate the temperature measurement wafer (1) without deteriorating its performance even under a higher temperature condition. Thus, the temperature measurement wafer (1) can be used under a higher temperature condition while improving the operation efficiency of the temperature measurement wafer (1).

A substrate holding device includes a porous component, a supporting component, a rotation driver, and a holding driver. The porous component includes an adsorbing surface that adsorbs a film of a framed substrate. The supporting component surrounds the porous component and supports a frame of the framed substrate. The rotation driver rotates the supporting component and the porous component in unison. The holding driver includes at least one magnet disposed opposite to the frame with respect to the supporting component and separated from the supporting component, the holding driver compressively holding the frame against the supporting component by a magnetic force of the magnet.

A deaeration apparatus of the present invention includes a tank (11) that stores a liquid to be deaerated, a circulation pipe having one end connected to an outflow port of the tank and the other end connected to an inflow port of the tank, a pump (15) that is provided in the circulation pipe and sucks and feeds the liquid in the tank, and a foaming device (6a) that is provided in the circulation pipe and causes the liquid to flow through a throttle portion having a narrowed flow path section to generate air bubbles from the liquid, wherein deaeration of the liquid stored in the tank (11) is performed by circulating the liquid between the tank (11) and the foaming device (6a).

The present invention relates to a substrate processing apparatus and a substrate processing method. A substrate processing apparatus includes a first front portion, a first rear portion, and a bridge portion that are arranged in this order in a front-rear direction. The first front portion includes a plurality of processing units. The first front portion includes a transport mechanism that transports a substrate to the processing units of the first front portion. The first rear portion includes a plurality of processing units. The first rear portion includes a transport mechanism that transports the substrate to the processing units of the first rear portion. The bridge portion includes the transport mechanism that places the substrate in the first front portion and the first rear portion.

The present invention relates to a substrate processing apparatus and a substrate processing method. A substrate processing apparatus includes an indexer portion, a slider portion, a bridge portion, a first front portion, and a first rear portion. The indexer portion, the slider portion, and the bridge portion are arranged in this order in a front-rear direction. The first front portion, the bridge portion, and the first rear portion are arranged in this order in the front-rear direction. The slider portion transports a substrate between the indexer portion and the bridge portion. The bridge portion transports the substrate between the slider portion and the first front portion. The bridge portion transports the substrate between the slider portion and the first rear portion. The first front portion includes a plurality of processing units. The first front portion includes a transport mechanism. The first rear portion includes a plurality of processing units. The first rear portion includes a transport mechanism. The slider portion overlaps with the processing units of the first front portion in plan view.

An imaging unit 55 captures an image of a hand unit 43 at a reference position Bs and an image of the hand unit 43 at an advanced position Cs where the hand unit 43 has advanced from the reference position Bs by an advanced amount P1. A position calculation unit 73 calculates an estimated moving amount L1 of the hand unit 43 from each image. A correction coefficient calculation unit 74 calculates a correction coefficient Mk based on the advanced amount P1 and the estimated moving amount L1. A calibration unit 75 calculates a calibrated moving amount H by calibrating a necessary moving amount E calculated based on an image of a conveyance target object with the correction coefficient Mk. Since the calibration unit 75 calibrates a difference between the advanced amount P1 and the estimated moving amount L1, the difference caused by the imaging unit 55 and optical images 81,82 can be eliminated in a configuration in which a position of a conveyance destination using optical images 81,82 captured by the imaging unit 55.

A substrate processing apparatus includes a front block, a cabinet portion, and a rear block. The front block includes a chamber. The rear block includes a chamber. The cabinet portion includes a processing liquid container, a pipe, and a liquid feeder. The processing liquid container stores a processing liquid. The pipe connects the processing liquid container and the chamber of the front block. The liquid feeder is provided on the pipe. The front block, the cabinet portion, and the rear block are arranged in this order in a front-rear direction.

A substrate processing apparatus includes: plurality of diverging pipes (PW) formed by branching of a merging pipe downstream of a pump (15) and configured to deliver processing liquid to a plurality of types of processing units in a chamber (41); and a control unit (139) configured to control the pump (15). The plurality of diverging pipes (PW) include a pre-wet pipe (PW) having a largest flow rate of processing liquid and a pot-rinse pipe (PTR) having a flow rate of processing liquid smaller than the flow rate of the pre-wet pipe (PW), a pressure sensor configured to detect a pressure of processing liquid is provided in the pre-wet pipe (PW) among the plurality of diverging pipes (PW), and the control unit (139) controls an output of a pump (15) to allow the pressure sensor (51) to detect a predetermined value.

A substrate imaging device includes an illuminator, an imager and a controller. The illuminator irradiates an upper surface of a substrate held by a substrate holding device with illumination light. The imager captures an image of the upper surface of the substrate irradiated with the illumination light. Based on an output of the imager, inspection image data representing a state of at least a partial area of the upper surface of the substrate is acquired. The inspection image data corresponds to light having a wavelength, with the light being absorbed by the substrate.

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After passing through a gap (15) defined between a suction roller (20) and a separation roller (11), an electrolyte membrane (92) is held on the suction roller (20) under suction, and a base material (91) is transported away from the outer peripheral surface of the suction roller (20). Thus, the base material (91) is separated from the electrolyte membrane (92). At this time, a gas is blown toward a plurality of ejection regions lying on the outside surface of the electrolyte membrane (92). The ejection regions are discontinuous in the width direction of the electrolyte membrane (92) and include opposite edges of the electrolyte membrane (92) as seen in the width direction. This suppresses the lift of the electrolyte membrane (92) on the opposite edges of the electrolyte membrane (92) as seen in the width direction where the force of suction is poor. The ejected gas passes through spaces defined between the ejection regions. This reduces the amount of gas flowing toward a catalyst supply part.

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