SCREEN Holdings Patente

To provide a manufacturing execution control system capable of shortening a processing lead time of a priority lot in a manufacturing line. In a manufacturing execution control system 1000, a virtualization processing apparatus 110 collects processing information by using a predetermined substrate cleaning apparatus group i as a hub in a wafer processing sequence, and, from an existing MES 100 side, the substrate cleaning apparatus group i is virtually identified and controlled as a single manufacturing apparatus using a single piece of identification information. Information for specifying a priority lot and information indicating priority are shared among group control apparatuses 310.i to 310.i+2 that control the substrate cleaning apparatus group i, and preparation for processing of the priority lot is notified in advance from a group control apparatus of a preceding process to a group control apparatus of a subsequent process. In the substrate cleaning apparatus group i of the subsequent process, preparation for processing the priority lot is performed in advance, thereby enabling the priority lot to be processed by overtaking other normal lots.

A dataset for machine learning is initially prepared. Next, labels are assigned to respective pieces of data included in the dataset. Subsequently, a problem related to the labels of the dataset is alleviated. Then, machine learning is performed using the improved dataset, whereby a learning model is created. Thereafter, a difference in tendency between the dataset used for machine learning and operational data to which the learning model is to be applied during actual operation is judged. The dataset is improved or created again if it is judged that there is a difference in tendency between the dataset and the operational data. In this manner, the quality of the dataset for machine learning is improved through multiple steps. Thus, the learning model is created while the quality of the dataset is maintained at a high level.

A method of creating a basic model for multiple machine learning models corresponding to multiple defect detection criteria. The method includes the steps of preparing first learning data (Da) (S101), extracting feature values from respective image data items (Di) of the first learning data (S102), performing clustering of the image data items in accordance with the feature values (S103), extracting some image data items-in accordance with the clustering result (S 104 to S 107), and creating a basic model (Mb) by performing learning using basic data (Db) (S108). The basic data includes data on common defectives identified as defectives in common on all of the defect detection criteria. By performing individual learning processing corresponding to the individual defect detection criteria on the basic model (Mb), it is possible to efficiently create a model with desired accuracy. That is, machine learning models corresponding to the individual defect detection criteria can be created with high accuracy and efficiency.

The cover member 51 performs the capping . In this capping, the cover member 51 covers the nozzles 421 from below by causing the ink receiving space 527 open upward to face the nozzle plane 42 from below while being stopped with respect to the discharge heads 44. The cover member 51 includes the liquid retaining member 541 for retaining the cleaning liquid, and the liquid retaining member 541 contacts the non-nozzle plane 43 during the execution of the capping. The ink can be removed from the non-nozzle plane 43 by diffusing the ink adhering to the non-nozzle plane 43 into the cleaning liquid. Since the cover member 51 is stopped with respect to the discharge heads 4 during the execution of the capping, the liquid retaining member 541 continues to continuously contact the non-nozzle plane 43. The ink can be effectively removed from the non-nozzle plane 43.

A defect inspection apparatus (1) includes a heater unit (9) to emit infrared rays (F2) to a substrate (W) held by a substrate holding unit (8) and heat the substrate (W), an infrared camera (10) to face a first principal surface (Wa) of the substrate (W) and image an imaging region (24) on the first principal surface (Wa); a heat insulating member (31) to absorb the infrared rays (F2) emitted by the heater unit (9), and a heat insulating member moving unit (50) to move the heat insulating member (31) between a heat insulation position (P10) where the heat insulating member (31) and the imaging region (24) overlap each other when viewed from a normal direction (Z) of the first principal surface (Wa) and a retracted position (P2) where the heat insulating member (31) and the imaging region (24) do not overlap each other when viewed from the normal direction (Z). The substrate holding unit (8) may be positioned between the heater unit (9) and the infrared camera (10) in the normal direction (z).

A processing liquid is supplied to a substrate by a processing nozzle. A processing image showing the substrate to which the processing liquid is supplied is generated by an imaging device. An input image receiver receives a first input image showing a state of the processing liquid on the substrate when an abnormality occurs in a substrate process. Based on the first input image, a shape model generator generates a shape model representing a three-dimensional shape of the processing liquid supplied to the substrate. A simulation executor simulates a transition of a state of the processing liquid in the shape model. An image generator generates an image showing a transition of the state of the processing liquid in a simulation. A collector collects the generated image as an abnormal image. An abnormality detector detects an abnormality in the substrate process based on a comparison between the processing image and the abnormal image.

In an etching method in accordance with the present invention, ultraviolet rays are irradiated to an etching solution. As a result, OH radicals are generated in the etching solution. Then, etching of a to-be-etched film is performed by the etching solution containing the OH radicals. Accordingly, it becomes possible to efficiently etch the to-be-etched film by using an etching solution on a substrate on which the to-be-etched film is formed to be adjacent to an insulating film.

A monitoring region is set by efficient processing, and the presence or absence of an anomaly related to an operational state of a monitoring target article is monitored efficiently. A processor of a substrate treatment apparatus sets a monitoring region three-dimensionally based on three-dimensional design information pertaining to the substrate treatment apparatus, generates a normal image for each of timings during a normal operation carried out based on a recipe by two-dimensionalizing the monitoring region in a view from a placement position, and stores the normal image in a normal image storage unit before performing an actual treatment on the substrate. Further, during working in which the substrate is actually treated based on the recipe, the processor detects an anomaly on the basis of a difference between the normal image and the real image captured by the camera, which are synchronized with the operation based on the recipe.

A substrate processing apparatus includes a processing unit and a transporter. The transporter includes an end effector including a first hand and a second hand and a hand movement driver moving the end effector in a horizontal direction. The first elevating driver moves the first support member to each of a first processing height position where a first direct contact part of the first support member having contact with a lower surface of the substrate is located above the first hand, a second processing height position where the first direct contact part is located between the first hand and the second hand, and a third processing height position where the first direct contact part is located below the second hand.

An electrolytic sulfuric acid supply apparatus includes a generation tank, a temperature control circulation pipe, and an electrolytic circulation pipe. The temperature control circulation pipe includes a common circulation pipe and a temperature control separate pipe. The electrolytic circulation pipe includes the common circulation pipe and an electrolytic separate pipe. A liquid feeder, a heater, and a first temperature sensor are arranged in the common circulation pipe. A temperature control circulation valve is disposed in the temperature control separate pipe. A filter, a cooler, an electrolytic cell, and a second temperature sensor are arranged in the electrolytic separate pipe. The electrolytic cell is disposed downstream of the cooler, and the second temperature sensor is disposed between the cooler and the electrolytic cell.

An electrolytic sulfuric acid supply apparatus includes a collection tank (TK1), a generation tank (TK2), a bidirectional pipe (71), a bidirectional first liquid feeder (72), an electrolytic circulator (6), a water supply (3), and a drain (4). The bidirectional pipe connects the collection tank and the generation tank. The first liquid feeder is disposed in the bidirectional pipe. The electrolytic circulator includes an electrolytic circulation pipe (61) connected to the generation tank and an electrolytic cell (65) disposed in the electrolytic circulation pipe. The water supply includes a water supply pipe (31) supplying water to the collection tank and a water supply valve (32). The drain includes a first drainage pipe (41) connected to the collection tank, a first drainage valve (42), a second drainage pipe (43) connected to the generation tank, and a second drainage valve (44).

Segmented images are prepared by dividing a large image. An intermediate target region is extracted from one segmented image selected, and an intermediate-region information item (82) indicating the range of the intermediate target region and an intermediate feature value (83) of the intermediate target region are acquired. This is repeated using each segmented image as the above one segmented image. Based on the acquired intermediate-region information items (82), an integrated feature value (83a) of a target region that integrates multiple intermediate target regions adjoining one another in the large image is obtained from intermediate feature values (83) of the multiple intermediate target regions.

Data that is used for retraining of a trained model is appropriately selected. A support apparatus is an apparatus for supporting retraining of a trained model constructed in a false report filter that determines appropriateness of defect determination for an image which has been determined by a defect inspection apparatus to have a defect and that filters a false report, the support apparatus tagging correct answer information, correctness information, and category information to a defect data set in which a determination result from the false report filter is tagged to each of a plurality of sets of image data that have been determined to have a defect, and displaying the defect data set on a display.

Realized is a measurement that accommodates diverse repeating patterns of an object to be measured. A measurement apparatus (1) includes: a first light receiving head (22) which receives first reflected light that is first inspection light having been projected from vertically above and reflected by a sample (100); a second light receiving head (32) which receives second reflected light that is second inspection light having been projected from obliquely above and reflected by the sample; and a processor (60), the first light receiving head having a first shutter (23) capable of adjusting an amount of the first reflected light received, the second light receiving head having a second shutter (33) capable of adjusting an amount of the second reflected light received, and the processor controlling an opening and closing amount of each of the first shutter and the second shutter.

The present invention provides a substrate treating method in which a gap in a peripheral edge portion of a laminate substrate obtained by laminating a plurality of substrates is filled with a filler, the method comprising acquiring a first transmission image of the peripheral edge portion of the laminate substrate, filling the gap in the peripheral edge portion of the laminate substrate after acquisition of the first transmission image with the filler, acquiring a second transmission image of the peripheral edge portion after filling with the filler, and determining a filling state of the filler by comparing the first transmission image and the second transmission image.

A method of processing a substrate W includes: holding the substrate W; and dispensing a processing liquid from a plurality of outlets of an elongated nozzle toward a main surface of the substrate W while the substrate W is rotated and the elongated nozzle is moved along a longitudinal direction, the elongated nozzle extending along the longitudinal direction, the plurality of outlets being aligned along the longitudinal direction.

The present invention relates to a substrate processing method and a substrate processing apparatus. The substrate processing method includes a treating step, a replacing step, and a pressure restoration step. In the treating step, a treating gas is supplied to a treatment space. The treatment space accommodates a substrate. In the replacing step, a pressure in the treatment space is kept lower than atmospheric pressure. In the replacing step, an inert gas is supplied to the treatment space. In the replacing step, a gaseous body is exhausted from the treatment space. In the pressure restoration step, the pressure in the treatment space returns to the atmospheric pressure. A flow rate of the inert gas supplied to the treatment space is a supply flow rate. A flow rate of the gaseous body exhausted from the treatment space is an exhaust flow rate. In the replacing step, at least either the supply flow rate or the exhaust flow rate changes with time.

A substrate processing apparatus includes a substrate holder, nozzles, pipes, a nozzle holder, an arm, and an arm drive section. The nozzle holder holds any one nozzle of the nozzles. The arm is coupled to the nozzle holder. The arm drive section moves the arm. The arm drive section moves the nozzle held by the nozzle holder. Each of the nozzles includes a dispensing port and a connection portion. Each of the pipes includes a downstream end portion. Each of the pipes has flexibility. The nozzle held by the nozzle holder is defined as a selection nozzle. The arm drive section moves the dispensing port of the selection nozzle to a processing position. The selection nozzle is rotatable about a rotation axis with respect to the arm. The rotation axis passes through the dispensing port of the selection nozzle.

A method of regenerating an organic solvent includes: collecting a mixed liquid of an organic solvent and water in a collection tank, the organic solvent and the water being discharged from a substrate processing apparatus that processes a substrate; and performing a separation operation of circulating the mixed liquid through a circulation path formed by the collection tank and a circulation pipe in which a membrane separator is disposed, and reducing, using a decompression pump, a pressure in a second path partitioned by a separation membrane in the membrane separator from a first path which is inserted into the circulation pipe and through which the mixed liquid passes, the performing including controlling the decompression pump with a control set value based on a target concentration on a solvent concentration of the mixed liquid.

An organic solvent regenerator includes a collection tank, an exhaust pipe, an exhaust valve, a circulator, a separation pipe, and a controller. An organic solvent and water flow into the collection tank through a collection pipe. The exhaust pipe in which the exhaust valve is disposed is connected to the collection tank. The controller opens the exhaust valve during at least a part of an inflow period in which at least one of the water and the organic solvent flows into the collection tank through the collection pipe, and closes the exhaust valve during at least a part of a separation operation period in which a separation operation of causing the circulator to circulate the mixed liquid and separating the water from the mixed liquid is performed.

An inkjet printing apparatus (1) comprises: a transport unit (2) that transports a base material (9) in a transport direction (d1); an inkjet unit (3) that ejects inks in a plurality of colors to the base material (9) being transported by the transport unit (2); a printing controller (811) that controls the inkjet unit (3) on the basis of image data (D61) to print an objective image (61) expressed by the image data (D61) on the base material (9); a drying unit (4) located on a downstream side of the transport direction (d1) with respect to the inkjet unit (3), the drying unit applying an infrared ray to the base material (9) to dry an ink ejected to the base material (9); a temperature sensor (5) that measures a temperature at a measurement target region (AS51) in the base material (9) applied with the infrared ray; and a monitoring part (851) that monitors the temperature at the measurement target region (A51) measured by the temperature sensor (5). The measurement target region (A51) for the temperature sensor (5) is a region where infrared absorbance is greater than an average value of infrared absorbance expressed by the image data (D61).

A substrate processing apparatus includes a substrate holder, a nozzle, a liquid flow path, an adjustment valve that adjusts a flow rate of the processing liquid flowing through the liquid flow path, a nozzle movement device that moves the nozzle, and a controller that controls the nozzle movement device based on a nozzle movement condition and controls an adjustment valve based on a valve condition. The nozzle movement condition includes a plurality of portion movement information pieces defining movement speeds of the nozzle when the nozzle moves through the plurality of portions of the substrate. The valve condition includes a plurality of valve control information pieces representing methods of controlling the valve when the nozzle moves through the plurality of portions of the substrate. The plurality of valve control information pieces include first valve control information, and second valve control information different from the first valve control information.

With this data processing method, a thinning-out step and a compression step are performed on input data items (D1 to D16) to obtain compression data (C). The thinning-out step (S2) involves a peak-point extraction step (S202) of extracting only peak points in the input data items (D1 to D16). In the compression step (S3), the compression data (C) is generated by changing the data format of thinned-out data items (T1 to T16) generated across multiple channels in the thinning-out step (S2) such that the number of offset bytes for every one of all channels and a channel data item for every one of all the channels are arranged in orderly sequence. In each channel data item, the number of skipped points for every one of all data points in the channel data item and a difference in data value for every one of all the data points are arranged in orderly sequence. This thinning-out and compression of data enable reversibly and appropriately compressing the data while avoiding a loss of essential signal elements. That is, it is possible to appropriately compress digital data measured at multiple points across a plurality of channels by using a multi-electrode array device.

A printer (9) includes a head (21) that ejects ink, and a maintenance unit (70) that performs maintenance of the head (21). The maintenance unit (70) includes a cleaning block (72) and a wiper (730). In a maintenance process, a controller (90) performs a cleaning process of causing the cleaning block (72) to supply a cleaning liquid to a nozzle surface (712) through a supplying hole (721) and to suck in a liquid adhering to the nozzle surface (712) through a suction hole (722), and a wiping process of causing the wiper (730) to wipe off the nozzle surface (712). The controller (90) keeps the pressure in the nozzle (200) at a predetermined first pressure (P₁) during printing and keeps the pressure in the nozzle (200) at a predetermined wiping pressure (Pw) during the cleaning process and the wiping process. The wiping pressure (Pw) is higher than the first pressure (P₁) and lower than a second pressure (P₂) under which the ink adheres to the wiper (730) during the wiping process. Accordingly, the nozzle surface is wiped off under appropriate conditions during the wiping of the ink adhering to the lower surface of the head.

This invention is relates to an optical apparatus for inspecting an optical integrated circuit. The optical apparatus includes a light source which emits light, an illumination optical unit which is configured to shape the light emitted from the light source into a predetermined shape, a modulator which includes a spatial light modulator on which the light shaped by the illumination optical unit is incident, the modulator emitting modulated light having a predetermined pattern shape by modulating incident light by the spatial light modulator and, and a light guide which guides the modulated light to an input end of an optical waveguide provided in the optical integrated circuit. A time required for an alignment processing can be largely shortened.

A substrate processing apparatus includes three processing casings stacked in a vertical direction. Each of the three processing casings includes, in an internal space, a spin chuck, an ejection unit, a cup that receives a coating liquid scattered from a substrate held by the spin chuck, a cup drainage flow path that is formed to extend vertically downward from the cup and that discharges the coating liquid received by the cup, a casing drainage flow path formed to extend in the vertical direction, and a connection flow path that connects a lower end of the cup drainage flow path and the casing drainage flow path. The respective casing drainage flow paths of the three processing casings are connected as the three processing casings are stacked in the vertical direction.

A substrate processing apparatus including: a batch processing block (7) for performing a batch process; a first orientation conversion mechanism (71) capable of converting substrates having been subjected to the batch process, from a vertical orientation to a horizontal orientation; a standby bath (55) where the substrates having been converted into the horizontal orientation are kept on standby; a lifting mechanism for performing an exposing operation of bringing one of the substrates kept on standby in the standby bath (55), the one being one substrate at a time, to a space above the standby bath (55); a center robot capable of carrying the substrates in the space above the standby bath (55) to outside; and a single-wafer processing block (8) including a single-wafer processing chamber (48) where the single-wafer process is performed to the substrates in the horizontal orientation, and the center robot (CR) carries the substrates from the space above the standby bath (55) into the single-wafer processing chamber (48).

A first head for ejecting first ink and a second head for ejecting second ink are arranged in order from an upstream side along a transport path for a base material. A surface-tensiondifference regulator executes regulation processing for changing a dynamic-surface-tension characteristic of at least one ink. In a case where the time when first ink droplets land on a target position of the base material is given as a first time, the time when second ink droplets land on the target position is given as a second time, and an absolute value of a difference between the dynamic surface tensions of the first ink droplets and the second ink droplets at the second time is given as a first-and-second ink surface tension difference, the first-and-second ink surface tension difference when the regulation processing is executed is smaller than that when the regulation processing is not executed.

A light wavefront measurement device includes a lens array, a light receiving sensor, and a wavefront shape calculation part. The lens array focuses measurement light for each region of the wavefront of the measurement light. The light receiving sensor receives multiple light spots focused by the lens array to output an electrical signal for pixels where the amount of received light has changed. The electrical signal indicates the direction of increase or decrease in the amount of received light and the time at which the amount of received light has changed. The wavefront shape calculation part calculates the wavefront shape of the measurement light, based on the electrical signal outputted from the light receiving sensor. The amount of information outputted from the light receiving sensor is smaller than that outputted for all pixels. The light receiving sensor is hence capable of outputting information about the displacement of the light spots with high time resolution. This allows the measurement of the wavefront shape of the measurement light with high time resolution, based on the information outputted from the light receiving sensor.

This observation apparatus 1 observes a particle trapped by a plurality of electrodes 72 extending in a direction crossing a channel 80 formed in a transparent substrate 9, and includes an imaging unit 31, a camera moving mechanism 32 that moves an imaged area of the imaging unit 31, and a control unit 10. The control unit 10 includes an end-electrode detection unit 511 that detects an end electrode 720a positioned at an end of the channel 80, an adjacent-electrode detection unit 512 that detects an adjacent electrode 720b adjacent to the end electrode 720a, a channel wall detection unit 513 that detects a sidewall 800w of the channel 80, and an observation position adjustment unit 514 that adjusts an observation position where the particle is observed, on the basis of the positions of the end electrode 720a, the adjacent electrode 720b, and the sidewall 800w. This enables proper alignment in observation of particles trapped in the vicinity of the electrodes 72 in the substrate 9 such as a micro-channel chip.

A substrate processing apparatus includes a nozzle device having a liquid discharger, a fluid supply system that supplies a processing liquid having a surface tension lower than that of a residual liquid to the nozzle device, a horizontal-direction driving device that moves the nozzle device to a plurality of different portions in a radial direction of a substrate in plan view while keeping the nozzle device at a position above the rotating substrate, and a controller that controls the fluid supply system and the horizontal-direction driving device according to a liquid processing condition. A liquid processing condition includes a liquid flow-rate condition that defines a flow rate of a processing liquid to be supplied to the nozzle device in each of the plurality of portions of the substrate, and a liquid movement condition that defines a movement speed of the nozzle device when the nozzle device moves to each of the plurality of portions of the substrate in order to supply the processing liquid to each of the plurality of portions of the substrate.

A brush device is attachable to and detachable from a brush holder. The brush holder is moved by a movement device. A brush of the brush device is pressed against an upper surface of a substrate held by a substrate holding device, and the substrate is cleaned. In a substrate cleaning device, with one brush device attached to the brush holder, another brush device is stored in a brush storage device. The brush holder is moved by a movement device to the brush storage device after an old brush device is detached. Another brush device is attached to the brush holder. The movement device includes an arm rotation driver and an arm movement driver that move the brush holder in two respective different directions.

A substrate processing method includes: a holding step of carrying a substrate into an inside of a chamber and holding said substrate; a supply step of supplying a fluid to the substrate on the inside of the chamber; an imaging step (S12) of sequentially imaging the inside of the chamber by a camera to acquire image data; a condition setting step (S11) of specifying a monitoring target from a plurality of monitoring target candidates in the chamber and changing an image condition based on the monitoring target; and a monitoring step (S13) of performing a monitoring process on the monitoring target based on the image data having the image condition corresponding to the monitoring target.

A substrate processing apparatus collectively processes a plurality of substrates with the plurality of substrates immersing in a processing liquid. The substrate processing apparatus includes a processing tank, a camera, and a controller. The processing tank stores the processing liquid. The camera is provided vertically higher above the processing tank and captures the inside of the processing tank to generate a plurality of items of captured image data. The controller generates smoothed image data obtained by smoothing a brightness distribution of waving caused on a liquid surface of the processing liquid based on integration of the plurality of items of captured image data, and monitors the inside of the processing tank based on the smoothed image data.

A temperature measurement wafer (1) includes a temperature sensor (3), a transmission unit (8), and a battery substrate (7). The transmission unit (8) wirelessly transmits temperature data of a temperature measurement subject measured by the temperature sensor (3) to the temperature measurement wafer (1). That is, the temperature measurement wafer (1) wirelessly transmits information to the outside, a decrease in operation efficiency caused by a communication wire can be avoided. The battery substrate (7) supplies power to each of the temperature sensor (3) and the transmission unit (8) using an all-solid-state secondary battery (21). Using the all-solid-state secondary battery (21) makes it possible to operate the temperature measurement wafer (1) without deteriorating its performance even under a higher temperature condition. Thus, the temperature measurement wafer (1) can be used under a higher temperature condition while improving the operation efficiency of the temperature measurement wafer (1).

A substrate holding device includes a porous component, a supporting component, a rotation driver, and a holding driver. The porous component includes an adsorbing surface that adsorbs a film of a framed substrate. The supporting component surrounds the porous component and supports a frame of the framed substrate. The rotation driver rotates the supporting component and the porous component in unison. The holding driver includes at least one magnet disposed opposite to the frame with respect to the supporting component and separated from the supporting component, the holding driver compressively holding the frame against the supporting component by a magnetic force of the magnet.

A substrate processing apparatus includes a front block, a cabinet portion, and a rear block. The front block includes a chamber. The rear block includes a chamber. The cabinet portion includes a processing liquid container, a pipe, and a liquid feeder. The processing liquid container stores a processing liquid. The pipe connects the processing liquid container and the chamber of the front block. The liquid feeder is provided on the pipe. The front block, the cabinet portion, and the rear block are arranged in this order in a front-rear direction.

The present invention relates to a substrate processing apparatus and a substrate processing method. A substrate processing apparatus includes a first front portion, a first rear portion, and a bridge portion that are arranged in this order in a front-rear direction. The first front portion includes a plurality of processing units. The first front portion includes a transport mechanism that transports a substrate to the processing units of the first front portion. The first rear portion includes a plurality of processing units. The first rear portion includes a transport mechanism that transports the substrate to the processing units of the first rear portion. The bridge portion includes the transport mechanism that places the substrate in the first front portion and the first rear portion.

A deaeration apparatus of the present invention includes a tank (11) that stores a liquid to be deaerated, a circulation pipe having one end connected to an outflow port of the tank and the other end connected to an inflow port of the tank, a pump (15) that is provided in the circulation pipe and sucks and feeds the liquid in the tank, and a foaming device (6a) that is provided in the circulation pipe and causes the liquid to flow through a throttle portion having a narrowed flow path section to generate air bubbles from the liquid, wherein deaeration of the liquid stored in the tank (11) is performed by circulating the liquid between the tank (11) and the foaming device (6a).

The present invention relates to a substrate processing apparatus and a substrate processing method. A substrate processing apparatus includes an indexer portion, a slider portion, a bridge portion, a first front portion, and a first rear portion. The indexer portion, the slider portion, and the bridge portion are arranged in this order in a front-rear direction. The first front portion, the bridge portion, and the first rear portion are arranged in this order in the front-rear direction. The slider portion transports a substrate between the indexer portion and the bridge portion. The bridge portion transports the substrate between the slider portion and the first front portion. The bridge portion transports the substrate between the slider portion and the first rear portion. The first front portion includes a plurality of processing units. The first front portion includes a transport mechanism. The first rear portion includes a plurality of processing units. The first rear portion includes a transport mechanism. The slider portion overlaps with the processing units of the first front portion in plan view.